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1
المؤلفون: Chao-Chieh Chan, Ping-Sen Wang, Christopher Greene, Chien-Yi Huang
المصدر: Soldering & Surface Mount Technology. 34:145-152
مصطلحات موضوعية: Yield (engineering), Materials science, business.industry, Soldering, SMT placement equipment, General Materials Science, Electrical and Electronic Engineering, Condensed Matter Physics, Process engineering, business, Stencil
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2
المؤلفون: Kuo-Hua Heish, Chao-Chieh Chan, Ming-Jhe Wu, Chih-Yang Weng, Yu-Da Dong, Chun-Jen Cheng
المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c1f62d032dbeff2e16c468d7ee1cc6ab
https://doi.org/10.1109/impact56280.2022.9966634 -
3
المؤلفون: Shen-Yu Yang, Wei-Shan Chang, Yi-Fong Wu, Chao-Tsu Chen, Ping-Sheng Yen, Chao-Chieh Chan
المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5e7643419cd2c0ea2ee7ebe48e0d47e0
https://doi.org/10.1109/impact56280.2022.9966683 -
4دورية أكاديمية
المؤلفون: Hui-Sung Kao, Chao-Chieh Chan
المصدر: Soochow Journal of Economics & Business; Mar2013, Issue 80, p81-117, 37p