المؤلفون: Parise, G., Chaparala, S., Parise, L., Allegri, M.

المصدر: IEEE Transactions on Industry Applications IEEE Trans. on Ind. Applicat. Industry Applications, IEEE Transactions on. 57(5):4456-4461 Jan, 2021

المؤلفون: Brusso, B., Chaparala, S.

المصدر: IEEE Industry Applications Magazine IEEE Ind. Appl. Mag. Industry Applications Magazine, IEEE. 20(6):8-12 Jan, 2014

المؤلفون: Pitarresi, J., Chaparala, S., Sammakia, B., Nguyen, L., Patwardhan, V., Zhang, L., Kelkar, N.

المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1323-1328 2002

Relation: Proceedings of 52nd Electronic Components and Technology Conference

المؤلفون: Chaparala, S. C., Xie, F., Caneau, C., Zah, C. E., Hughes, L. C.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(12):1975-1982 Dec, 2011

المؤلفون: Xie, F., Caneau, C., LeBlanc, H. P., Visovsky, N. J., Chaparala, S. C., Deichmann, O. D., Hughes, L. C., Zah, C., Caffey, D. P., Day, T.

المصدر: IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 17(5):1445-1452 Jan, 2011

المؤلفون: Wang Z, Pascal LE, Chandran UR, Chaparala S, Lv S, Ding H, Qi L

المصدر: Cancer Management and Research, Vol Volume 12, Pp 4411-4427 (2020)

مصطلحات موضوعية: du145, pc-3, stat1, irf, cdk2, Neoplasms. Tumors. Oncology. Including cancer and carcinogens, RC254-282

وصف الملف: electronic resource

Relation: https://www.dovepress.com/ell2-is-required-for-the-growth-and-survival-of-ar-negative-prostate-c-peer-reviewed-article-CMAR; https://doaj.org/toc/1179-1322

URL الوصول: https://doaj.org/article/44550bbb0cc843e78a971ee2a26e4e2d

المؤلفون: Chaparala, S., Andros, F., Infantolino, W., Sammakia, B.

المصدر: 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on. :720-725 May, 2008

Relation: 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM)

المؤلفون: Ewais MM, Chaparala S, Uhl R, Jaroszewski DE

المصدر: Patient Related Outcome Measures, Vol Volume 9, Pp 65-90 (2018)

مصطلحات موضوعية: adult, complications, minimally invasive surgery, pectus excavatum, quality of life, Medicine (General), R5-920

وصف الملف: electronic resource

Relation: https://www.dovepress.com/outcomes-in-adult-pectus-excavatum-patients-undergoing-nuss-repair-peer-reviewed-article-PROM; https://doaj.org/toc/1179-271X

URL الوصول: https://doaj.org/article/6ed03421a6aa4495bd35f5092b8c6060

المؤلفون: Chaparala, S.

المصدر: IEEE Industry Applications Magazine IEEE Ind. Appl. Mag. Industry Applications Magazine, IEEE. 19(3):68-69 Jun, 2013

المؤلفون: Chaparala, S., Bhagavatula, V., Himmelreich, J.

المصدر: 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on. :1/9-9/9 Apr, 2011

Relation: 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)