المؤلفون: Shahidi, G.G., Ning, T.H., Chappell, T.I., Comfort, J.H., Chappell, B.A., Franch, R., Anderson, C.J., Cook, P.W., Schuster, S.E., Rosenfield, M.G., Polcari, M.R., Dennard, R.H., Davari, B.

المصدر: Proceedings of IEEE International Electron Devices Meeting Electron devices Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International. :813-816 1993

Relation: Proceedings of IEEE International Electron Devices Meeting

المؤلفون: Schuster, S.E., Chappell, T.I., Chappell, B.A., Franch, R.L.

المصدر: ESSCIRC '91: Proceedings - Seventeenth European Solid-State Circuits Conference Solid-State Circuits Conference, 1991. ESSCIRC '91. Proceedings - Seventeenth European. 1:209-212 Sep, 1991

Relation: Seventeenth European Solid State Circuits Conference

المؤلفون: Hinton, G., Upton, M., Sager, D.J., Boggs, D., Carmean, D.M., Roussel, P., Chappell, T.I., Fletcher, T.D., Milshtein, M.S., Sprague, M., Samaan, S., Murray, R.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 36(11):1617-1627 Nov, 2001

المؤلفون: Chappell, T.I., Chappell, B.A., Schuster, S.E., Allan, J.W., Kepner, S.P., Joshi, R.V., French, R.L.

المصدر: 1991 IEEE International Solid-State Circuits Conference. Digest of Technical Papers Solid-State Circuits Conference, 1991. Digest of Technical Papers. 38th ISSCC., 1991 IEEE International. :50-288 1991

Relation: 1991 IEEE International Solid-State Circuits Conference. Digest of Technical Papers

المؤلفون: Shahidi, G.G., Anderson, C.A., Chappell, B.A., Chappell, T.I., Comfort, J.H., Davari, B., Dennard, R.H., Franch, R.L., McFarland, P.A., Neely, J.S., Ning, T.H., Polcari, M.R., Warnock, J.D.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 41(12):2405-2412 Dec, 1994

المؤلفون: Schuster, S.E., Chappell, T.I., Chappell, B.A., Franch, R.L.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 27(7):1073-1079 Jul, 1992

المؤلفون: Chappell, T.I., Chappell, B.A., Schuster, S.E., Allan, J.W., Klepner, S.P., Joshi, R.V., Franch, R.L.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 26(11):1577-1585 Nov, 1991

المؤلفون: Haring, R.A., Milshtein, M.S., Chappell, T.I., Dhong, S.H., Chappell, B.A.

المصدر: 1996 Symposium on VLSI Circuits. Digest of Technical Papers VLSI circuits VLSI Circuits, 1996. Digest of Technical Papers., 1996 Symposium on. :18-19 1996

Relation: 1996 Symposium on VLSI Circuits. Digest of Technical Papers

المؤلفون: Towler, F., Chu, J., Houghton, R., Lane, P., Chappell, B.A., Chappell, T.I., Schuster, S.E.

المصدر: IEEE International Solid-State Circuits Conference, 1989 ISSCC. Digest of Technical Papers Solid-State Circuits Conference, 1989. Digest of Technical Papers. 36th ISSCC., 1989 IEEE International. :30-31 1989

Relation: IEEE International Solid-State Circuits Conference, 1989 ISSCC. Digest of Technical Papers

المؤلفون: Chappell, T.I.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 27(4):760-766 Apr, 1980