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1دورية أكاديمية
المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 71(4):3944-3952 Apr, 2024
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2دورية أكاديمية
المؤلفون: Fontaine, J., Che, F., Shahid, A., Van Herbruggen, B., Ahmed, Q.Z., Bin Abbas, W., De Poorter, E.
المصدر: IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 11(3):4085-4101 Feb, 2024
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3دورية أكاديمية
المؤلفون: Che, F., Ahmed, Q.Z., Khan, F.A.
المصدر: IEEE Communications Letters IEEE Commun. Lett. Communications Letters, IEEE. 27(4):1130-1134 Apr, 2023
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4دورية أكاديمية
المصدر: IEEE Access Access, IEEE. 11:81914-81920 2023
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5دورية أكاديمية
المؤلفون: Che, F., Ahmed, Q.Z., Fontaine, J., Van Herbruggen, B., Shahid, A., De Poorter, E., Lazaridis, P.I.
المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(19):18726-18739 Oct, 2022
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6مؤتمر
المؤلفون: Che, F. X., Zhang, X. R., Ji, L.
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1525-1532 Jun, 2020
Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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7مؤتمر
المؤلفون: Chong, Chai Tai, Teck Guan, Lim, Yong, Han, Che, F. X., Ho Soon Wee, David, Chong, Ser Choong
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :19-24 Jun, 2020
Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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8مؤتمر
المؤلفون: Che, F. X., Yamamoto, K., Rao, Vempati Srinivasa
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :2097-2104 Jun, 2020
Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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9مؤتمر
المؤلفون: Li, H. Y., Kawano, M., Lim, P. S., Che, F. X., Chua, H. M.
المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :258-262 Dec, 2019
Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
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10مؤتمر
المؤلفون: Bu, Lin, Che, F. X., Rao, Vempati Srinivasa, Zhang, Xiaowu
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1152-1158 May, 2019
Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)