يعرض 1 - 10 نتائج من 1,113 نتيجة بحث عن '"Che, F."', وقت الاستعلام: 1.11s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Step Displacement Improving Method of Inertial Actuated Piezoelectric Robot Based on Diagonal Deformation Trajectory

    المؤلفون: Li, J., Deng, J., Zhang, S., Che, F., Liu, Y.

    المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 71(4):3944-3952 Apr, 2024

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  2. 2
    دورية أكاديمية
    Transfer Learning for UWB Error Correction and (N)LOS Classification in Multiple Environments

    المؤلفون: Fontaine, J., Che, F., Shahid, A., Van Herbruggen, B., Ahmed, Q.Z., Bin Abbas, W., De Poorter, E.

    المصدر: IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 11(3):4085-4101 Feb, 2024

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  3. 3
    دورية أكاديمية
    Novel Fine-Tuned Attribute Weighted Naïve Bayes NLoS Classifier for UWB Positioning

    المؤلفون: Che, F., Ahmed, Q.Z., Khan, F.A.

    المصدر: IEEE Communications Letters IEEE Commun. Lett. Communications Letters, IEEE. 27(4):1130-1134 Apr, 2023

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  4. 4
    دورية أكاديمية
    High-Capacity Quantum Private Comparison Protocol With Six-Qubit Hyperentangled Bell States and Hypercoding

    المؤلفون: Li, J., Che, F., Wang, Z., Yang, J.

    المصدر: IEEE Access Access, IEEE. 11:81914-81920 2023

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  5. 5
    دورية أكاديمية
    Feature-Based Generalized Gaussian Distribution Method for NLoS Detection in Ultra-Wideband (UWB) Indoor Positioning System

    المؤلفون: Che, F., Ahmed, Q.Z., Fontaine, J., Van Herbruggen, B., Shahid, A., De Poorter, E., Lazaridis, P.I.

    المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(19):18726-18739 Oct, 2022

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  6. 6
    مؤتمر
    Thermal Aging Induced Underfill Degradation and Its Effect on Reliability of Advanced Packaging

    المؤلفون: Che, F. X., Zhang, X. R., Ji, L.

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1525-1532 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package

    المؤلفون: Chong, Chai Tai, Teck Guan, Lim, Yong, Han, Che, F. X., Ho Soon Wee, David, Chong, Ser Choong

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :19-24 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Panel Warpage and Die Shift Simulation and Characterization of Fan-Out Panel-Level Packaging

    المؤلفون: Che, F. X., Yamamoto, K., Rao, Vempati Srinivasa

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :2097-2104 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Reliability Study of Low Cost TSV-Free Interposer (TFI)

    المؤلفون: Li, H. Y., Kawano, M., Lim, P. S., Che, F. X., Chua, H. M.

    المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :258-262 Dec, 2019

    Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

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  10. 10
    مؤتمر
    Mechanism of Moldable Underfill (MUF) Process for RDL-1^st Fan-Out Panel Level Packaging (FOPLP)

    المؤلفون: Bu, Lin, Che, F. X., Rao, Vempati Srinivasa, Zhang, Xiaowu

    المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1152-1158 May, 2019

    Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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