المؤلفون: Ran, S., Zou, M., Mizzell, G., Chen, C.H.

المصدر: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 59(11):1-5 Nov, 2023

المؤلفون: Grafner, S.J., Huang, J.H., Shih, P.S., Renganathan, V., Kung, P.Y., Chen, Y.A., Huang, C.H., Chen, C.H., Kao, C.R.

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :644-649 Dec, 2022

Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Wu, Shien-Yang, Chang, C.H., Chiang, M.C., Lin, C.Y., Liaw, J.J., Cheng, J.Y., Yeh, J.Y., Chen, H.F., Chang, S.Y., Lai, K.T., Liang, M.S., Pan, K.H., Chen, J.H., Chang, V.S., Luo, T.C., Wang, X., Mor, Y.S., Lin, C.I., Wang, S.H., Hsieh, M.Y., Chen, C.Y., Wu, B.F., Lin, C.J., Liang, C.S., Tsao, C.P., Li, C.T., Chen, C.H., Hsieh, C.H., Liu, H.H., Chen, P.N., Chen, C.C., Chen, R., Yeo, Y.C., Chui, C.O., Chang, W., Lee, T.L., Huang, K.B., Lin, H.J., Chen, K.W., Tsai, M.H., Chen, K.S., Chen, X.M., Cheng, Y.K., Wang, C.H., Shue, W., Ku, Y., Jang, S. M., Cao, M., Lu, L.C., Chang, T.S.

المصدر: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :27.5.1-27.5.4 Dec, 2022

Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Chen, C.H., Parashar, P., Akbar, C., Fu, S.M., Syu, M., Lin, A.

المصدر: IEEE Access Access, IEEE. 7:130168-130179 2019

المؤلفون: Chen, Y.H., Chen, W.Y., Lin, Y.S., Chen, C.H., Zhou, Rui, Chou, T.H., Li, W.P., Wang, X., Chen, S.C., Chen, C.Y., Zhu, Y.T., Huang, J.C.

المصدر: In Journal of Materials Research and Technology July-August 2023 25:3803-3818

المؤلفون: Do, Nhan, Yang, J.W., Sheng, Y. J., Su, C. S., Wu, M. T., Ouyang, H., Liang, H., Hariharan, S., Tadayoni, M., Norman, J., Vu, T., Ly, A., Hong, S., Tran, H., Tiwari, V., Chen, C.H., Ou, T.F., Shih, C.C.

المصدر: 2018 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2018 IEEE International. :1-3 May, 2018

Relation: 2018 IEEE International Memory Workshop (IMW)

المؤلفون: Huang, C.Y., Fu, S.M., Parashar, P., Chen, C.H., Akbar, C., Lin, A.S.

المصدر: IEEE Access Access, IEEE. 6:78402-78413 2018

المؤلفون: Aguilar, J.A., Anker, A., Allison, P., Archambault, S., Baldi, P., Barwick, S.W., Beatty, J.J., Beise, J., Besson, D., Bishop, A., Bondarev, E., Botner, O., Bouma, S., Buitink, S., Cataldo, M., Chen, C.C., Chen, C.H., Chen, P., Chen, Y.C., Choi, T., Clark, B.A., Clay, W., Curtis-Ginsberg, Z., Connolly, A., Cremonesi, L., Dasgupta, P., Davies, J., de Kockere, S., de Vries, K.D., Deaconu, C., DuVernois, M.A., Flaherty, J., Friedman, E., Gaior, R., Gaswint, G., Glaser, C., Hallgren, A., Hallmann, S., Ham, Y.-B., Hanson, J.C., Harty, N., Hendricks, B., Hoffman, K.D., Hong, E., Hornhuber, C., Hsu, S.Y., Hu, L., Huang, J.J., Huang, M.-H., Hughes, K., Ishihara, A., Jee, G., Jung, J., Karle, A., Kelley, J.L., Klein, S.R., Kleinfelder, S.A., Kim, J., Kim, K.-C., Kim, M.-C., Kravchenko, I., Krebs, R., Ku, Y., Kuo, C.Y., Kurusu, K., Kwon, Hyuck-Jin, Lahmann, R., Landsman, H., Latif, U., Lee, C., Leung, C.-H., Li, C.-J., Liu, J., Liu, T.-C., Lu, M.-Y., Madison, K., Mammo, J., Mase, K., McAleer, S., Meures, T., Meyers, Z.S., Michaels, K., Mikhailova, M., Mulrey, K., Nam, J., Nichol, R.J., Nir, G., Nelles, A., Novikov, A., Nozdrina, A., Oberla, E., Oeyen, B., Osborn, J., Pan, Y., Pandya, H., Paul, M.P., Persichilli, C., Pfendner, C., Plaisier, I., Punsuebsay, N., Pyras, L., Rice-Smith, R., Roth, J., Ryckbosch, D., Scholten, O., Seckel, D., Seikh, M.F.H., Shiao, Y.-S., Shin, B.-K., Shultz, A., Smith, D., Southall, D., Tatar, J., Torres, J., Toscano, S., Tosi, D., Touart, J., Van Den Broeck, D.J., van Eijndhoven, N., Varner, G.S., Vieregg, A.G., Wang, M.-Z., Wang, S.-H., Wang, Y.H., Welling, C., Williams, D.R., Wissel, S., Xie, C., Yoshida, S., Young, R., Zhao, L., Zink, A.

المصدر: In Astroparticle Physics March 2023 145

المؤلفون: Kumaravelu, T.A., Ramakrishnan, A., Lu, Y.R., Chen, J.L., Chen, S.W., Du, C.H., Chen, M.Y., Yeh, P.H., Kandasami, A., Chen, C.H., Dong, C.L.

المصدر: In Materials Today Chemistry January 2023 27

المؤلفون: Wen, T.Y., Colombeau, B., Li, C.l., Liu, S.Y., Guo, B.N., Meer, H.V., Hou, M., Yang, B., Feng, H.C., Hsu, C.F., Huang, C.C., Tasi, Y.T., Chen, H.P., Huang, S.A., Huang, C.W., Chen, C.H., Lin, J.C., Shim, K.H., Kuo, J., Lee, S., Holcman, L., Nafisr, K., Fernandez, J., Fung, D., Yang, N.H., Wu, J.Y., Hung, G.C.

المصدر: 2019 Symposium on VLSI Technology VLSI Technology, 2019 Symposium on. :T110-T111 Jun, 2019

Relation: 2019 Symposium on VLSI Technology