المؤلفون: Qin, Shijuan, Chang, Patt, Lee, Falconee, Su, Thonas, Chen, Denis, Guo, Ariel, Yuan, Weijie, Cao, Mark, Chang, Aje, Fan, Donald, Li, Yl, Hsu, Jimmy, Liang, Kevin, Tsai, Bryant, Tzeng, Kate

المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Su, Thonas, Liu, Zoe, Hsu, Jimmy, Chen, Denis, Chen, Paul

المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Hsu, Jimmy, Lee, Leo, Hsiao, Eric, Yang, Joseph, Wu, Dian-Ying, Wu, Jay, Wu, Dong-Han, Yang, Tina, Chen, Denis

المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Tsai, Gary, Chen, Denis

المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-3 Oct, 2022

Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Hsu, Jimmy, Lin, Lemon, Ho, Brian, Hsiao, Neo, Chen, Denis, Su, Thonas, Zhang, Xinjun

المصدر: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2021 16th International. :119-122 Dec, 2021

Relation: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Chen, Denis, Chen, Youqing, Lai, Dirack, Umoh, Ifiok J

المصدر: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :239-242 Oct, 2020

Relation: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Su, Thonas, Chen, Denis, Hsu, Jimmy, Li, Y L

المصدر: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2019 14th International. :138-141 Oct, 2019

Relation: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Su, Thonas, Chen, Denis, Hsu, Jimmy, Li, Y. L.

المصدر: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), 2019 Joint International Symposium on. :183-186 Jun, 2019

Relation: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)

المؤلفون: Hsu, Jimmy, Lin, Cucumber, Ku, Morgan, Su, Thonas, Chen, Denis

المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :154-156 Oct, 2018

Relation: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Cai, Xingjian Kinger, Ling, Yun, Ji, Steven Yun, Hsiao, Jimmy, Chen, Chi-te, Chen, Denis

المصدر: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), 2018 IEEE International Symposium on. :64-66 May, 2018

Relation: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)