يعرض 1 - 10 نتائج من 52 نتيجة بحث عن '"Chen, Han-Wen"', وقت الاستعلام: 1.08s تنقيح النتائج
  1. 1
    مؤتمر
    Signal & Power Integrity Optimization Utilizing Silicon Core Substrate

    المؤلفون: Ayers, Seann, Verhaverbeke, Steven, Chen, Han-Wen, Jiang, Liu, Bazizi, El Mehdi

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :279-284 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  2. 2
    مؤتمر
    Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polymer Build Up Films

    المؤلفون: Harish, Vineeth, Sahoo, Krutikesh, Zheng, Kai, Park, Gilbert, Chen, Han-Wen, Verhaverbeke, Steven, Iyer, Subramanian S.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2178-2183 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  3. 3
    مؤتمر
    Universal Delay Compensation for Model Predictive Current Control of Three-Phase Inverters

    المؤلفون: Chen, Dong-Hai, Chen, Han-Wen, Qiu, Yu-Tao, Hu, Tie-Jun, Huang, Jun, Zhu, Hai-Bo, Zhang, Yong, Gu, Zhi-Xia

    المصدر: 2022 Asia Power and Electrical Technology Conference (APET) Power and Electrical Technology Conference (APET), 2022 Asia. :225-230 Nov, 2022

    Relation: 2022 Asia Power and Electrical Technology Conference (APET)

    أضف إلى المفضلة
  4. 4
    مؤتمر
    Novel CMP Material Solution To Enable High Removal Rate Dielectric CMP For Hybrid Bonding Application

    المؤلفون: Chakraborty, Tapash, Verhaverbeke, Steven, Chen, Han-Wen, Chandran, Gopi

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :540-541 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

    أضف إلى المفضلة
  5. 5
    مؤتمر
    New and Unique CMP Material Solution for the Enablement of High Removal Rate Polymer CMP and other Advanced Packaging Applications

    المؤلفون: Chakraborty, Tapash, Goradia, Prerna, Verhaverbeke, Steven, Chen, Han-Wen, Buch, Chintan, Lianto, Prayudi

    المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :41-43 Dec, 2020

    Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

    أضف إلى المفضلة
  6. 6
    مؤتمر
    2.5D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages

    المؤلفون: Ravichandran, Siddharth, Yamada, Shuhei, Park, Giback, Chen, Han-Wen, Shi, Tailong, Buch, Chintan, Liu, Fuhan, Smet, Vanessa, Sundaram, Venky, Tummala, Rao

    المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :625-630 May, 2018

    Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  7. 7
    دورية أكاديمية
    The circular RNA circSlc7a11 promotes bone cancer pain pathogenesis in rats by modulating LLC-WRC 256 cell proliferation and apoptosis

    المؤلفون: Chen, Han-WenAff1, Aff2, Zhang, Xiao-Xia, Peng, Zhu-Ding, Xing, Zu-Min, Zhang, Yi-Wen, Li, Ya-LanAff1

    المصدر: Molecular and Cellular Biochemistry: An International Journal for Chemical Biology in Health and Disease. 476(4):1751-1763

    Find this article in full text from Springer Verlag. Find this article in full text from ProQuest Full Text Finder
    أضف إلى المفضلة
  8. 8
    دورية أكاديمية
    Isolation and characterization of a chlorate-reducing bacterium Ochrobactrum anthropi XM-1

    المؤلفون: Chen, Han-Wen, Xu, Meng, Ma, Xi-Wen, Tong, Zhong-Hua, Liu, Dong-Feng

    المصدر: In Journal of Hazardous Materials 15 December 2019 380

    View record from ScienceDirect Full Text Finder
    أضف إلى المفضلة
  9. 9
    New and Unique CMP Material Solution for the Enablement of High Removal Rate Polymer CMP and other Advanced Packaging Applications

    المؤلفون: Buch Chintan, Tapash Chakraborty, Chen Han-Wen, Prerna Goradia, Steven Verhaverbeke, Lianto Prayudi

    المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).

    مصطلحات موضوعية: chemistry.chemical_classification, Materials science, Polishing, Polymer, Epoxy, Substrate (printing), Surface finish, Grinding, chemistry, Chemical engineering, visual_art, Chemical-mechanical planarization, Slurry, visual_art.visual_art_medium

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d4c68b6c39d7d370f485427a9ce837af
    https://doi.org/10.1109/eptc50525.2020.9314866

    أضف إلى المفضلة
  10. 10
    دورية أكاديمية
    Predictive Risk Factors for Upper Gastrointestinal Bleeding with Simultaneous Myocardial Injury

    المؤلفون: Wu, I-Chen, Yu, Fang-Jung, Chou, Jun-Jen, Lin, Tzeng-Jih, Chen, Han-Wen, Lee, Chee-Siong, Wu, Deng-Chyang

    المصدر: In Kaohsiung Journal of Medical Sciences 2007 23(1):8-16

    View record from ScienceDirect View record at Wiley Full Text via ClinicalKey Full Text Finder
    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء