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1مؤتمر
المؤلفون: Khwa, Win-San, Wu, Ping-Chun, Wu, Jui-Jen, Su, Jian-Wei, Chen, Ho-Yu, Ke, Zhao-En, Chiu, Ting-Chien, Hsu, Jun-Ming, Cheng, Chiao-Yen, Chen, Yu-Chen, Lo, Chung-Chuan, Liu, Ren-Shuo, Hsieh, Chih-Cheng, Tang, Kea-Tiong, Chang, Meng-Fan
المصدر: 2024 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2024 IEEE International. 67:568-570 Feb, 2024
Relation: 2024 IEEE International Solid-State Circuits Conference (ISSCC)
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2مؤتمر
المؤلفون: Wu, Ping-Chun, Su, Jian-Wei, Hong, Li-Yang, Ren, Jin-Sheng, Chien, Chih-Han, Chen, Ho-Yu, Ke, Chao-En, Hsiao, Hsu-Ming, Li, Sih-Han, Sheu, Shyh-Shyuan, Lo, Wei-Chung, Chang, Shih-Chieh, Lo, Chung-Chuan, Liu, Ren-Shuo, Hsieh, Chih-Cheng, Tang, Kea-Tiong, Chang, Meng-Fan
المصدر: 2023 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2023 IEEE International. :126-128 Feb, 2023
Relation: 2023 IEEE International Solid-State Circuits Conference (ISSCC)
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3مؤتمر
المؤلفون: Wu, Ping-Chun, Su, Jian-Wei, Chung, Yen-Lin, Hong, Li-Yang, Ren, Jin-Sheng, Chang, Fu-Chun, Wu, Yuan, Chen, Ho- Yu, Lin, Chen-Hsun, Hsiao, Hsu-Ming, Li, Sih-Han, Sheu, Shyh-Shyuan, Chang, Shih-Chieh, Lo, Wei-Chung, Lo, Chung-Chuan, Liu, Ren-Shuo, Hsieh, Chih-Cheng, Tang, Kea-Tiong, Wu, Chih-I, Chang, Meng-Fan
المصدر: 2022 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2022 IEEE International. 65:1-3 Feb, 2022
Relation: 2022 IEEE International Solid-State Circuits Conference (ISSCC)
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4دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
5دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
6دورية
المؤلفون: Wu, Ping-Chun, Su, Jian-Wei, Hong, Li-Yang, Ren, Jin-Sheng, Chien, Chih-Han, Chen, Ho-Yu, Ke, Chao-En, Hsiao, Hsu-Ming, Li, Sih-Han, Sheu, Shyh-Shyuan, Lo, Wei-Chung, Chang, Shih-Chieh, Lo, Chung-Chuan, Liu, Ren-Shuo, Hsieh, Chih-Cheng, Tang, Kea-Tiong, Chang, Meng-Fan
المصدر: IEEE Journal of Solid-State Circuits; January 2024, Vol. 59 Issue: 1 p196-207, 12p