المؤلفون: Ji, D. F., Niu, B., Tao, H. Q., Chen, T. S., Wang, W. B.

المصدر: 2022 Photonics & Electromagnetics Research Symposium (PIERS) Photonics & Electromagnetics Research Symposium (PIERS), 2022. :752-754 Apr, 2022

Relation: 2022 Photonics & Electromagnetics Research Symposium (PIERS)

المؤلفون: He, C.Y., Tang, K. H., Chen, T. S., Chang, K. Y., Lin, C. H., Sato, K., Jou, S. J., Chen, P. H., Chen, H. M., Rong, B. D., Itoh, K.

المصدر: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC) Asian Solid-State Circuits Conference (A-SSCC), 2019 IEEE. :227-230 Nov, 2019

Relation: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC)

المؤلفون: Chen, T.-S., Hou, K.-N., Pua, Y.-W., Wu, A.-Y.

المصدر: 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Solid-State and Integrated Circuit Technology (ICSICT), 2018 14th IEEE International Conference on. :1-4 Oct, 2018

Relation: 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

المؤلفون: Chen, C. C., Chen, T. S., Yeh, K., Cheng, M. H., Huang, J. K., Hung, P. W.

المصدر: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2017 28th Annual SEMI. :384-386 May, 2017

Relation: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

المؤلفون: Chang, H. H., Hsiao, Z. C., Chien, C. H., Zhan, C. J., Hsin, Y. C., Tzeng, P. J., Chen, T. S., Ko, C. T., Lo, W. C., Kao, M. J.

المصدر: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2014. :1-6 Sep, 2014

Relation: 2014 Electronics System-Integration Technology Conference (ESTC)

المؤلفون: Chang, H. H., Chien, C. H., Lee, Y. C., Lee, S. M., Wang, J. C., Huang, Y. W., Zhan, C. J., Hsiao, Z. C., Tzeng, P. J., Lee, C. H., Chen, T. S., Ko, C. T., Lo, W. C., Kao, M. J.

المصدر: 2014 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2014 International Conference on. :39-43 Apr, 2014

Relation: 2014 International Conference on Electronics Packaging (ICEP)

المؤلفون: Yang, Y., Huo, S., Jiang, L. H., Kong, Y. C., Chen, T. S., Zhou, H., Teh, A. S., Butler, T., Hasko, D., Amaratunga, G. A.

المصدر: 2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC) Electron Devices and Solid State Circuits (EDSSC), 2018 IEEE International Conference on. :1-2 Jun, 2018

Relation: 2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC)

المؤلفون: Zhang, K., Zhu, G. R., Kong, Y.C., Chen, T. S.

المصدر: 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) Microwave and Millimeter Wave Technology (ICMMT), 2018 International Conference on. :1-2 May, 2018

Relation: 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

المؤلفون: Hung, C.-H., Chang, M.-F., Yang, Y.-S., Kuo, Y.-J., Lai, T.-N., Shen, S.-J., Hsu, J.-Y., Hung, S.-N., Lue, H.-T., Shih, Y.-H., Huang, S.-L., Chen, T.-W., Chen, T. S., Chen, C. K., Hung, C.-Y., Lu, C.-Y.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 50(6):1491-1501 Jun, 2015

المؤلفون: Zhou, J. J., Dong, X., Kong, C., Kong, Y. C., Ren, C. J., Li, Z. H., Chen, T. S., Chen, C., Zhang, B.

المصدر: Proceedings of 2012 5th Global Symposium on Millimeter-Waves Millimeter Waves (GSMM), 2012 5th Global Symposium on. :617-620 May, 2012

Relation: 2012 5th Global Symposium on Millimeter Waves (GSMM 2012)