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1مؤتمر
المؤلفون: Liu, Cong, Gan, Guisheng, Huang, Tian, Ma, Peng, He, An, Zhu, Zhikai, Cheng, Dayong, Li, Chuntian, Ma, Yongchong
المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022
Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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2مؤتمر
المؤلفون: Huang, Tian, Gan, Guisheng, Ma, Peng, Liu, Cong, Ma, Yongchong, Yang, Zhenyu, Cheng, Dayong, Li, Chuntian, Zhao, Jing
المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022
Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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3دورية أكاديمية
المؤلفون: Gan, Guisheng, Chen, Shi-qi, Jiang, Liujie, Liu, Cong, Ma, Peg, Huang, Tian, Cheng, Dayong, Liu, Xin
المصدر: Soldering & Surface Mount Technology, 2023, Vol. 35, Issue 4, pp. 189-198.
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4دورية أكاديمية
المؤلفون: Huang, Tian, Gan, Guisheng, Liu, Cong, Ma, Peng, Ma, Yongchong, Tang, Zheng, Cheng, Dayong, Liu, Xin, Tian, Kun
المصدر: Microelectronics International, 2023, Vol. 40, Issue 2, pp. 70-80.
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5دورية أكاديمية
المؤلفون: Gan, Guisheng, Chen, Shiqi, Jiang, Liujie, Jiang, Zhaoqi, Liu, Cong, Ma, Peng, Cheng, Dayong, Liu, Xin
المصدر: Soldering & Surface Mount Technology, 2022, Vol. 35, Issue 2, pp. 95-105.
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6دورية أكاديمية
المؤلفون: Wang, Zhongqi, Li, Haihong, Cheng, Dayong, Qin, Shiteng, Li, Deshan, Zhang, Xintao
المصدر: Materials & Corrosion / Werkstoffe und Korrosion; Jul2024, Vol. 75 Issue 7, p924-931, 8p
مصطلحات موضوعية: COPPER tubes, HEAT exchangers, AIR conditioning, FAILURE analysis, COPPER analysis, TUBES, COMBUSTION gases
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7دورية أكاديمية
المؤلفون: Xu, Qianzhu, Gan, Guisheng, Jiang, Zhaoqi, Chen, Shiqi, Huang, Tian, Liu, Cong, Ma, Peng, Cheng, Dayong, Wu, Yiping
المصدر: In Journal of Advanced Joining Processes November 2021 4
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8كتاب
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9دورية أكاديمية
المؤلفون: Gan, Guisheng, Chen, Shiqi, Jiang, Liujie, Liu, Cong, Huang, Tian, Ma, Peng, Cheng, Dayong, Liu, Xin
المصدر: Soldering & Surface Mount Technology; 2023, Vol. 35 Issue 3, p143-154, 12p
مصطلحات موضوعية: COPPER, SOLDER & soldering, SHEAR strength, ULTRASONICS, INTERMETALLIC compounds, COPPER-tin alloys
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10دورية أكاديمية
المؤلفون: Gan, Guisheng, Chen, Shiqi, Jiang, Liujie, Xu, Qianzhu, Huang, Tian, Cheng, Dayong, Liu, Xin
المصدر: Soldering & Surface Mount Technology; 2023, Vol. 35 Issue 3, p155-165, 11p
مصطلحات موضوعية: ALUMINUM-zinc alloys, LOW temperatures, COPPER, SHEAR strength, INTERMETALLIC compounds, POWDERS