المؤلفون: Cheng, H. K., Kou, K. P., Wong, K. I.

المصدر: 2022 10th International Conference on Traffic and Logistic Engineering (ICTLE) Traffic and Logistic Engineering (ICTLE), 2022 10th International Conference on. :78-82 Aug, 2022

Relation: 2022 10th International Conference on Traffic and Logistic Engineering (ICTLE)

المؤلفون: Lin, Po-Yao, Yew, M. C., Yeh, S. S., Chen, S. M., Lin, C. H., Chen, C. S., Hsieh, C. C., Lu, Y. J., Chuang, P. Y., Cheng, H. K., Jeng, Shin-Puu

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :723-728 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Yeung, Zenon W. C.^Aff21, Ku, Peter K. M.^Aff21, Abdullah, Victor^Aff21, Cho, Ryan H. W.^Aff21, To, Zion W. H.^Aff21, Lee, Monica^Aff21, Chan, Miu Yue^Aff21, Lee, Tebby K. W.^Aff22, Yip, Boris^Aff23, Cham, Terence^Aff24, Ku, Benny^Aff25, Pang, Joanna^Aff25, Li, K. M.^Aff26, Tse, M. L.^Aff26, Yuen, Kenny K. Y.^Aff27, Cheng, H. K.^Aff28, Tong, Michael C. F.^Aff29

المساهمون: Kasabov, Nikola, Series Editor^Aff1, Amari, Shun-ichi, Editorial Board Member^Aff2, Avesani, Paolo, Editorial Board Member^Aff3, Benuskova, Lubica, Editorial Board Member^Aff4, Brown, Chris M., Editorial Board Member^Aff5, Duro, Richard J, Editorial Board Member^Aff6, Georgieva, Petia, Editorial Board Member^Aff7, Hou, Zeng-Guang, Editorial Board Member^Aff8, Indiveri, Giacomo, Editorial Board Member^Aff9, King, Irwin, Editorial Board Member^Aff10, Kozma, Robert, Editorial Board Member^Aff11, König, Andreas, Editorial Board Member^Aff12, Mandic, Danilo, Editorial Board Member^Aff13, Masulli, Francesco, Editorial Board Member^Aff14, Thivierge, JeanPhilippe, Editorial Board Member^Aff15, Villa, Allessandro E.P, Editorial Board Member^Aff16, Adibi, Sasan, editor^Aff17, Rajabifard, Abbas, editor^Aff18, Shariful Islam, Sheikh Mohammed, editor^Aff19, Ahmadvand, Alireza, editor^Aff20

المصدر: The Science behind the COVID Pandemic and Healthcare Technology Solutions. 15:107-117

المؤلفون: Cheng, H.-C., Cheng, H.-K., Lu, S.-T., Juang, J.-Y., Chen, W.-H.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 14(1):499-511 Mar, 2014

المؤلفون: Rawat, R. S., Cheng, H. K., Tan, L. K., Patran, A., Hassan, S. M., Zhang, T., Springham, S. V., Tan, T. L., Lee, P.

المصدر: IEEE Conference Record - Abstracts. 2005 IEEE International Conference on Plasma Science Plasma Science, 2005. ICOPS '05. IEEE Conference Record - Abstracts. IEEE International Conference on. :239-239 Jun, 2005

Relation: IEEE Conference Record - Abstracts. 2005 IEEE International Conference on Plasma Science

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المؤلفون: Cheng, H. K.^Aff3, Hafez, M. M.^Aff4

المساهمون: Moreau, R., editor^Aff1, Sobieczky, H., editor^Aff2

المصدر: IUTAM Symposium Transsonicum IV : Proceedings of the IUTAM Symposium held in Göttingen, Germany, 2–6 September 2002. 73:331-342

المؤلفون: Cheng, H. K. F., Chong, M. F., Liu, E., Zhou, K., Li, L.

المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. July 2014 117(1):63-71

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المؤلفون: Cheng, H. K., Johnson, E. R.

المصدر: Proceedings of the Royal Society of London. Series A, Mathematical and Physical Sciences, 1982 Sep 01. 383(1784), 71-87.

URL الوصول: https://www.jstor.org/stable/2397351