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1مؤتمر
المؤلفون: Cheng, H. K., Kou, K. P., Wong, K. I.
المصدر: 2022 10th International Conference on Traffic and Logistic Engineering (ICTLE) Traffic and Logistic Engineering (ICTLE), 2022 10th International Conference on. :78-82 Aug, 2022
Relation: 2022 10th International Conference on Traffic and Logistic Engineering (ICTLE)
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2مؤتمر
المؤلفون: Lin, Po-Yao, Yew, M. C., Yeh, S. S., Chen, S. M., Lin, C. H., Chen, C. S., Hsieh, C. C., Lu, Y. J., Chuang, P. Y., Cheng, H. K., Jeng, Shin-Puu
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :723-728 Jun, 2021
Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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3كتاب إلكتروني
المؤلفون: Yeung, Zenon W. C.Aff21, Ku, Peter K. M.Aff21, Abdullah, VictorAff21, Cho, Ryan H. W.Aff21, To, Zion W. H.Aff21, Lee, MonicaAff21, Chan, Miu YueAff21, Lee, Tebby K. W.Aff22, Yip, BorisAff23, Cham, TerenceAff24, Ku, BennyAff25, Pang, JoannaAff25, Li, K. M.Aff26, Tse, M. L.Aff26, Yuen, Kenny K. Y.Aff27, Cheng, H. K.Aff28, Tong, Michael C. F.Aff29
المساهمون: Kasabov, Nikola, Series EditorAff1, Amari, Shun-ichi, Editorial Board MemberAff2, Avesani, Paolo, Editorial Board MemberAff3, Benuskova, Lubica, Editorial Board MemberAff4, Brown, Chris M., Editorial Board MemberAff5, Duro, Richard J, Editorial Board MemberAff6, Georgieva, Petia, Editorial Board MemberAff7, Hou, Zeng-Guang, Editorial Board MemberAff8, Indiveri, Giacomo, Editorial Board MemberAff9, King, Irwin, Editorial Board MemberAff10, Kozma, Robert, Editorial Board MemberAff11, König, Andreas, Editorial Board MemberAff12, Mandic, Danilo, Editorial Board MemberAff13, Masulli, Francesco, Editorial Board MemberAff14, Thivierge, JeanPhilippe, Editorial Board MemberAff15, Villa, Allessandro E.P, Editorial Board MemberAff16, Adibi, Sasan, editorAff17, Rajabifard, Abbas, editorAff18, Shariful Islam, Sheikh Mohammed, editorAff19, Ahmadvand, Alireza, editorAff20
المصدر: The Science behind the COVID Pandemic and Healthcare Technology Solutions. 15:107-117
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4دورية أكاديمية
المؤلفون: Cheng, H.-C., Cheng, H.-K., Lu, S.-T., Juang, J.-Y., Chen, W.-H.
المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 14(1):499-511 Mar, 2014
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5مؤتمر
المؤلفون: Rawat, R. S., Cheng, H. K., Tan, L. K., Patran, A., Hassan, S. M., Zhang, T., Springham, S. V., Tan, T. L., Lee, P.
المصدر: IEEE Conference Record - Abstracts. 2005 IEEE International Conference on Plasma Science Plasma Science, 2005. ICOPS '05. IEEE Conference Record - Abstracts. IEEE International Conference on. :239-239 Jun, 2005
Relation: IEEE Conference Record - Abstracts. 2005 IEEE International Conference on Plasma Science
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6دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
7كتاب إلكتروني
المؤلفون: Cheng, H. K.Aff3, Hafez, M. M.Aff4
المساهمون: Moreau, R., editorAff1, Sobieczky, H., editorAff2
المصدر: IUTAM Symposium Transsonicum IV : Proceedings of the IUTAM Symposium held in Göttingen, Germany, 2–6 September 2002. 73:331-342
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8دورية أكاديمية
المؤلفون: Cheng, H. K. F., Chong, M. F., Liu, E., Zhou, K., Li, L.
المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. July 2014 117(1):63-71
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9دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
10دورية أكاديمية
المؤلفون: Cheng, H. K., Johnson, E. R.
المصدر: Proceedings of the Royal Society of London. Series A, Mathematical and Physical Sciences, 1982 Sep 01. 383(1784), 71-87.
URL الوصول: https://www.jstor.org/stable/2397351