المؤلفون: LI Wenzhe, QIAN Feng, CHENG Xingwang

المصدر: Cailiao gongcheng, Vol 51, Iss 3, Pp 29-38 (2023)

مصطلحات موضوعية: medium- and high-strength aluminum alloy, additive manufacturing, defect, process parameter optimization, alloy composition optimization, nucleant agent addition, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2022.000038; https://doaj.org/toc/1001-4381

URL الوصول: https://doaj.org/article/434e54321bcd4e9784796ac37eb9b760

المؤلفون: LI Sining, WANG Zhibing, CHENG Xingwang, ZHANG Xia

المصدر: Di-san junyi daxue xuebao, Vol 43, Iss 22, Pp 2462-2467 (2021)

مصطلحات موضوعية: osteoarthritis, total knee arthroplasty, femora lateral bowing, varus knees, Medicine (General), R5-920

وصف الملف: electronic resource

Relation: http://aammt.tmmu.edu.cn/Upload/rhtml/202105076.htm; https://doaj.org/toc/1000-5404

URL الوصول: https://doaj.org/article/12d2a82df7014737acda1e210041cfac

المؤلفون: Xu Xuefeng, Ali Tayyeb, Wang Lin, Cheng Huanwu, Zhou Zhe, Ning Zixuan, Liu Xiaopin, Liu Anjin, Zhang Binbin, Cheng Xingwang

المصدر: Journal of Materials Research and Technology, Vol 9, Iss 5, Pp 11509-11516 (2020)

مصطلحات موضوعية: Titanium alloy, Dynamic compression properties, Deformation mechanism, Twin, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785420316410; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/175de9bbafb9472bbb7348e4c8e9651c

المؤلفون: Yang, Xiaohong^{Aff1, Aff2, IDs42823024006892_cor1}, Cheng, Xingwang^{Aff1, Aff2}, Chen, Yu, Xiao, Peng^{Aff1, Aff2}

المصدر: Carbon Letters. 34(5):1317-1327

المؤلفون: Li, Ce, Chang, Xufeng, Wang, Bingguang, Ma, Zhaolong, Cheng, Xingwang

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Mudasar, M., ZH, XU, SY, Lian, Li, Xiang^{Aff1, IDs1085402412473z_cor4}, Cheng, Xingwang^{Aff1, IDs1085402412473z_cor5}

المصدر: Journal of Materials Science: Materials in Electronics. 35(11)

المؤلفون: He, Yangyu, Liu, Yifan, Wang, Hongke, Liu, Ya, Feng, Xiangxiang, Zhang, Zhaohui, Liu, Luojing, Jia, Xiaotong, Wang, Qiang, Cheng, Xingwang

المصدر: In Journal of Alloys and Compounds 15 July 2024 992

المؤلفون: Zhang, Xinghai, Yang, Chao, Zhu, Haofei, Xiong, Zhiping, Cheng, Xingwang

المصدر: In Journal of Materials Research and Technology July-August 2024 31:2900-2914

المؤلفون: Li, Jinyue, Qian, Feng, Pan, Shiwei, Zhang, Fei, Guo, Chun, Xu, Shun, Liu, Meng, Cheng, Xingwang

المصدر: In Journal of Materials Science & Technology 20 June 2024 185:121-132

المؤلفون: Yuan, Jingjiu, Fan, Qunbo, Liu, Weifeng, Xu, Shun, Yang, Lin, Li, Shan, Ying, Jiayao, Zhang, Hongmei, Cheng, Xingwang

المصدر: In Materials Science & Engineering A June 2024 902