يعرض 1 - 6 نتائج من 6 نتيجة بحث عن '"Cheng-En Rich Wu"', وقت الاستعلام: 1.01s تنقيح النتائج
  1. 1
    Validation of machine learning OPC compact models for advanced manufacturing

    المؤلفون: Moongyu Jeong, Marco Guajardo, Tim Fuehner, Li-Jin Chen, Lena Zavyalova, Cheng-En (Rich) Wu, Song-haeng Lee, Hua Song, Kevin Lucas

    المصدر: Design-Process-Technology Co-optimization XV.

    مصطلحات موضوعية: business.industry, Computer science, SIGNAL (programming language), Stability (learning theory), Machine learning, computer.software_genre, Validation methods, Modelling methods, Convergence (routing), Hardware_INTEGRATEDCIRCUITS, Advanced manufacturing, Production (economics), Artificial intelligence, business, computer

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::001fdd9e63c1c804ed224086e20d9d3c
    https://doi.org/10.1117/12.2584940

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  2. 2
    Improved validation and optimization of physics-based NTD compact modeling flows

    المؤلفون: Kevin Lucas, Cheng-En (Rich) Wu, Delian Yang, Folarin Latinwo, Peter Brooker, Hua Song, Yulu Chen

    المصدر: Optical Microlithography XXXII.

    مصطلحات موضوعية: Resist, Process (computing), Electronic engineering, Linearity, Wafer, Sensitivity (control systems), Lithography, Critical dimension, Metrology

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7ac89863110e16a9bfdb9910d13add5d
    https://doi.org/10.1117/12.2516344

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  3. 3
    Investigation of machine learning for dual OPC and assist feature printing optimization

    المؤلفون: Cheng-En (Rich) Wu, Kevin Lucas, Peter Brooker, Kevin Hooker, Yulu Chen, Marco Guajardo, Folarin Latinwo

    المصدر: Design-Process-Technology Co-optimization for Manufacturability XIII.

    مصطلحات موضوعية: Artificial neural network, Computer science, business.industry, Deep learning, Extreme ultraviolet lithography, Process (computing), Hardware_PERFORMANCEANDRELIABILITY, Machine learning, computer.software_genre, Resist, Feature (computer vision), Hardware_INTEGRATEDCIRCUITS, Wafer, Artificial intelligence, business, Lithography, computer

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ed64714b6d55349d00e44766214ed545
    https://doi.org/10.1117/12.2516134

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  4. 4
    مؤتمر
    Improved validation and optimization of physics-based NTD compact modeling flows.

    المؤلفون: Latinwo, Folarin, Yang, Delian, Cheng-En (Rich) Wu, Brooker, Peter, Yulu Chen, Hua Song, Lucas, Kevin

    المصدر: Proceedings of SPIE; 1/24/2019, Vol. 10961, p109610G-1-109610G-10, 10p

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  5. 5
    Improving 3D resist profile compact modeling by exploiting 3D resist physical mechanisms

    المؤلفون: Thomas Schmoeller, Hua Song, Cheng-En Rich Wu, Yongfa Fan, Qian Ren

    المصدر: SPIE Proceedings.

    مصطلحات موضوعية: Resist, Computer science, Etching, Interface (computing), Calibration, Process (computing), Node (circuits), Wafer, Lithography process, Lithography, Simulation, Image (mathematics)

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9b747fe4eb9e1d3e3dd817a91d4a7be3
    https://doi.org/10.1117/12.2048999

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  6. 6
    AF printability check with a full-chip 3D resist profile model

    المؤلفون: Cheng-En Rich Wu, James P. Shiely, Jason Chang, Hua Song

    المصدر: SPIE Proceedings.

    مصطلحات موضوعية: Engineering drawing, Materials science, Resist, Anisotropic diffusion, Physical approach, Wafer, Linear combination, Chip, Lithography, Algorithm, Free parameter

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::178dd5b15b3ebc3a6d8ab0ca65101b78
    https://doi.org/10.1117/12.2027843

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