المؤلفون: Lee, Jeng-Dao, Ye, Yu-Cheng, Ho, Chi-Ting, Liu, Guan-Zhi, Chen, Lin-Yin, Hung, Ying-Hsiu

المصدر: 2024 10th International Conference on Applied System Innovation (ICASI) Applied System Innovation (ICASI), 2024 10th International Conference on. :1-3 Apr, 2024

Relation: 2024 10th International Conference on Applied System Innovation (ICASI)

المؤلفون: Bai, Jia-Hau, Liu, Chi-Ting, Wang, Yu, Chang, Fu-Chieh, Wu, Pei-Yuan

مصطلحات موضوعية: Computer Science - Computer Vision and Pattern Recognition, Computer Science - Artificial Intelligence, Computer Science - Machine Learning

URL الوصول: http://arxiv.org/abs/2407.09550

المؤلفون: Chi, Ting Ta, Li, Zhenyu, Yu, Haitao, Yoo, Jae Ok, Sundaram, Arvind, Feng, Xu, Choong, Chong Ser, Lee, Wen

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :12-15 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Ji, Hong-Miao, Cheemalamarri, Hemanth Kumar, Chi, Ting-Ta, Serene, Hui-ting Lim, Teo Dickson, Wei-Jie, Alfred, Siang-Kiat Neo, Li, Hong-Yu, Jon, Gim-Guan Chen, Venkataraman, Nandini, Lee, Wen

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :421-424 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Chi, Ting-Hsun, Perng, Wen, Chen, Homer

المصدر: 2023 IEEE International Symposium on Mixed and Augmented Reality (ISMAR) ISMAR Mixed and Augmented Reality (ISMAR), 2023 IEEE International Symposium on. :177-184 Oct, 2023

Relation: 2023 IEEE International Symposium on Mixed and Augmented Reality (ISMAR)

المؤلفون: Chi, Ting Ta, Li, Zhenyu, Li, Nanxi, Cai, Hong, Tobing Landobasa, Y M, Yu, Haitao, Darshini, Senthilkumar, Yoo, Jae Ok, Sundaram, Arvind, Rao, B.S.S. Chandra, Lee, Lennon Y. T., Lee, Wen

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1880-1884 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Chen, Yi-Zih, Chen, Terrance Yu-Hao, Su, Po-Jung, Liu, Chi-Ting

مصطلحات موضوعية: Computer Science - Networking and Internet Architecture

URL الوصول: http://arxiv.org/abs/2311.02311

المؤلفون: Hsin-Yi Chang (ORCID 0000-0002-9659-1022), Chen-Chung Liu, Chi-Ting Wen (ORCID 0000-0003-0161-0823), Ming-Hua Chang, Shih-Hsun Fan Chiang, Fu-Kwun Hwang

المصدر: International Journal of Science Education. 2024 46(1):46-72.

Peer Reviewed: Y

Page Count: 27

Descriptors: Computer Simulation, Virtual Classrooms, Laboratories, Models, Middle School Students, Scientific Literacy, Teaching Methods, Curriculum Design, Low Achievement, Science Instruction, STEM Education, Foreign Countries

مصطلحات جغرافية: Taiwan

المؤلفون: Chi, Ting Ta, Li, Nanxi, Cai, Hong, Li, Zhenyu, Tobing, Landobasa Y M, Yu, Haitao, Lee, Lennon Y. T., Lee, Wen

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :138-141 Dec, 2022

Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Tang, L.J., Woo, Jasmine, Chew, Michelle, Lee, Kenneth, Chi, Ting Ta

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :783-786 Dec, 2022

Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)