يعرض 1 - 10 نتائج من 337 نتيجة بحث عن '"Chiang, K.-N."', وقت الاستعلام: 0.91s تنقيح النتائج
  1. 1
    مؤتمر
    Study on the feasible mesh size control method for WLP 3D finite element modeling

    المؤلفون: Chen, Y. J., Yuan, Cadmus, Chiang, K. N.

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  2. 2
    مؤتمر
    Sensitivity Study of Wafer-Level Packaging Lifetime Prediction Using Different Creep Constitutive Equations

    المؤلفون: Lee, C. E., Yuan, Cadmus, Chiang, K. N.

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  3. 3
    مؤتمر
    Using Grid Search Methods and Parallel Computing to Reduce AI Training Time for Reliability Lifetime Prediction of Wafer-Level Packaging

    المؤلفون: Chang, C. Y., Lee, C. H., Chiang, K. N.

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-5 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  4. 4
    مؤتمر
    The Effect of Geometric and Material Uncertainty on Debonding Warpage in Fan-Out Panel Level Packaging

    المؤلفون: Chen, H. L., Chiang, K. N.

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  5. 5
    مؤتمر
    Studying Asymmetric Warpage Behavior of Panel-Level Packages Using Process Modeling Techniques and Viscoelasticity Theory

    المؤلفون: Shu, Z., Chiang, K. N.

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  6. 6
    مؤتمر
    Study on Reliability Assessment of Wafer Level Package Using Design-on-Simulation with Support Vector Regression Techniques

    المؤلفون: Kuo, H. C., Lai, B. R., Chiang, K. N.

    المصدر: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :192-195 Oct, 2020

    Relation: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  7. 7
    مؤتمر
    Prediction of Fan-out Panel Level Warpage using Neural Network Model with Edge Detection Enhancement

    المؤلفون: Liu, S. W, Panigrahy, S. K., Chiang, K. N.

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1626-1631 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Research on Polynomial Regression Machine Learning Model with K-Means Algorithm for Predicting Advanced Packaging Reliability

    المؤلفون: Liao, H. H., Chiang, K. N.

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :143-144 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

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  9. 9
    مؤتمر
    Reliability Assessment of WLCSP using Energy Based Model with Inelastic Strain Energy Density

    المؤلفون: Lee, Y. C., Chiang, K. N.

    المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :329-332 Apr, 2019

    Relation: 2019 International Conference on Electronics Packaging (ICEP)

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  10. 10
    مؤتمر
    Prediction of Fan-Out Level Packaging Warpage using PSO-based Modified Convolutional Neural Network model with Laplacian Filter

    المؤلفون: Huang, G. R., Chen, M. Y., Chiang, K. N.

    المصدر: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :101-102 May, 2021

    Relation: 2021 International Conference on Electronics Packaging (ICEP)

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