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1مؤتمر
المؤلفون: Chen, Y. J., Yuan, Cadmus, Chiang, K. N.
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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2مؤتمر
المؤلفون: Lee, C. E., Yuan, Cadmus, Chiang, K. N.
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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3مؤتمر
المؤلفون: Chang, C. Y., Lee, C. H., Chiang, K. N.
المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-5 Apr, 2023
Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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4مؤتمر
المؤلفون: Chen, H. L., Chiang, K. N.
المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023
Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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5مؤتمر
المؤلفون: Shu, Z., Chiang, K. N.
المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023
Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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6مؤتمر
المؤلفون: Kuo, H. C., Lai, B. R., Chiang, K. N.
المصدر: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :192-195 Oct, 2020
Relation: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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7مؤتمرPrediction of Fan-out Panel Level Warpage using Neural Network Model with Edge Detection Enhancement
المؤلفون: Liu, S. W, Panigrahy, S. K., Chiang, K. N.
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1626-1631 Jun, 2020
Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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8مؤتمر
المؤلفون: Liao, H. H., Chiang, K. N.
المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :143-144 May, 2022
Relation: 2022 International Conference on Electronics Packaging (ICEP)
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9مؤتمر
المؤلفون: Lee, Y. C., Chiang, K. N.
المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :329-332 Apr, 2019
Relation: 2019 International Conference on Electronics Packaging (ICEP)
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10مؤتمر
المؤلفون: Huang, G. R., Chen, M. Y., Chiang, K. N.
المصدر: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :101-102 May, 2021
Relation: 2021 International Conference on Electronics Packaging (ICEP)