يعرض 1 - 10 نتائج من 204 نتيجة بحث عن '"Chiang, Kuo-Ning"', وقت الاستعلام: 0.82s تنقيح النتائج
  1. 1
    مؤتمر
    A robust mesh size control technology suitable for various empirical equations for predicting solder joint reliability

    المؤلفون: Chiang, Kuo-Ning, Lee, C. E., Yuan, Cadmus

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :234-239 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Equation Informed Neural Networks with Bayesian Inference Improvement for the Coefficient Extraction of the Empirical Formulas

    المؤلفون: Yuan, Cadmus, Wang, Jing Yu, Lee, Cheng En, Chiang, Kuo-Ning

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-5 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  3. 3
    مؤتمر
    Study on an Artificial Intelligence Based Kernel Ridge Regression Algorithm for Wafer Level Package Reliability Prediction

    المؤلفون: Panigrahy, Sunil Kumar, Chiang, Kuo-Ning

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1435-1441 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Warpage and Simulation Analysis of Panel Level FO-WLCSP Using Equivalent CTE

    المؤلفون: Liu, Shih-Wei, Tsai, Chia-Han, Chiang, Kuo-Ning

    المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :242-245 Apr, 2019

    Relation: 2019 International Conference on Electronics Packaging (ICEP)

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  5. 5
    مؤتمر
    Trace line Layout Design of FO-WLCSP

    المؤلفون: Shen, Yih-Ting, Liu, Yu-Hsiang, Chiang, Kuo-Ning

    المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :149-152 Apr, 2019

    Relation: 2019 International Conference on Electronics Packaging (ICEP)

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  6. 6
    مؤتمر
    Design and reliability assessment of stacked fan-out packaging

    المؤلفون: Wang, Pao-Hsiung, Huang, An, Chiang, Kuo-Ning

    المصدر: 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) Pan Pacific Microelectronics Symposium (Pan Pacific), 2018. :1-6 Feb, 2018

    Relation: 2018 Pan Pacific Microelectronics Symposium (Pan Pacific)

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  7. 7
    مؤتمر
    A Modified Acceleration Factor Empirical Equation for BGA Type Package

    المؤلفون: Hsu, Min-Hsuan, Lee, Chang-Chun, Chiang, Kuo-Ning

    المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :1020-1026 May, 2017

    Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Finite element mesh size effect for reliability assessment of WLCSP using different creep theories

    المؤلفون: Wu, Pei-Lun, Wang, Pao-Hsiung, Hsu, Min-Hsuan, Chiang, Kuo-Ning

    المصدر: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :180-183 Oct, 2016

    Relation: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  9. 9
    مؤتمر
    Characteristic study of anand and modified anand creep models for area array type WLCSP

    المؤلفون: Ramachandran, Velsankar, Chiang, Kuo-Ning

    المصدر: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :99-102 Oct, 2016

    Relation: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  10. 10
    مؤتمر
    Characterization of Thermal Cycling Ramp Rate and Dwell Time Effects on AF (Acceleration Factor) Estimation

    المؤلفون: Wu, K. C., Lee, C. H., Chiang, Kuo-Ning

    المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :251-256 May, 2016

    Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

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