المؤلفون: Ming-Che Hsieh, Chih-Kuang Yu

المصدر: EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. :1-7 Apr, 2008

Relation: 2008 Intl. Conf. on Thermal, Mechanical & Multi-Physics simulation and Experiments in Microelectronics

المؤلفون: Chun Kai Liu, Ming-Ji Dai, Chih-Kuang Yu, Sheng-Liang Kuo

المصدر: 2007 International Microsystems, Packaging, Assembly and Circuits Technology Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International. :29-33 Oct, 2007

Relation: 2007 International Microsystems, Packaging, Assembly and Circuits Technology

المؤلفون: Chun-Kai Liu, Chih-Kuang Yu, Chung-Yen Hsu, Sheng-Liang Kuo, Ming-Ji Dai

المصدر: 2007 International Microsystems, Packaging, Assembly and Circuits Technology Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International. :88-92 Oct, 2007

Relation: 2007 International Microsystems, Packaging, Assembly and Circuits Technology

المؤلفون: Chih-Kuang Yu, Chun-Kai Liu, Ming-Ji Dai, Sheng-Liang Kuo, Chung-Yen Hsu

المصدر: 2007 26th International Conference on Thermoelectrics Thermoelectrics, 2007. ICT 2007. 26th International Conference on. :274-278 Jun, 2007

Relation: 2007 26th International Conference on Thermoelectrics (ICT 2007)

المؤلفون: Mei-Jiau Huang, Tai-Ming Chang, Chun-Kai Liu, Chih-Kuang Yu

المصدر: International Journal of Heat and Mass Transfer. 51:4470-4479

مصطلحات موضوعية: Fluid Flow and Transfer Processes, Debye sheath, Condensed matter physics, Phonon, Mechanical Engineering, Condensed Matter Physics, symbols.namesake, Normal mode, Dispersion relation, symbols, Einstein solid, Debye function, Debye model, Debye length

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::de258eec6ac9d8b4ac0b98e27cecde8a
https://doi.org/10.1016/j.ijheatmasstransfer.2008.02.007

المؤلفون: Ding Chong Lu, Chih Kuang Yu

المصدر: International Journal of Heat and Mass Transfer. 50:3624-3637

مصطلحات موضوعية: Fluid Flow and Transfer Processes, Materials science, Fin, Critical heat flux, Mechanical Engineering, Bubble, Thermodynamics, Heat transfer coefficient, Condensed Matter Physics, Annular fin, Heat flux, Boiling, Heat transfer, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0625d7adac4349dfad42adfcfa9759c9
https://doi.org/10.1016/j.ijheatmasstransfer.2007.02.003

المؤلفون: Chun-Kai Liu, Mei-Jiau Huang, Wen-Yen Chong, Chih-Kuang Yu, Tai-Ming Chang

المصدر: International Journal of Heat and Mass Transfer. 50:67-74

مصطلحات موضوعية: Fluid Flow and Transfer Processes, Materials science, Phonon scattering, Condensed matter physics, Phonon, business.industry, Mechanical Engineering, Boundary (topology), Condensed Matter Physics, symbols.namesake, Semiconductor, Scattering rate, Phase (matter), symbols, Thin film, business, Debye model

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a6f89e6b44c5f0d5de9a5d3847912ab8
https://doi.org/10.1016/j.ijheatmasstransfer.2006.06.044

المؤلفون: Ding Chong Lu, Tsung Chieh Cheng, Chih Kuang Yu

المصدر: Journal of Micromechanics and Microengineering. 16:2092-2099

مصطلحات موضوعية: Flow visualization, Chemistry, Critical heat flux, Mechanical Engineering, Liquid dielectric, Thermodynamics, Heat transfer coefficient, Electronic, Optical and Magnetic Materials, Heat flux, Mechanics of Materials, Boiling, Heat transfer, Electrical and Electronic Engineering, Composite material, Nucleate boiling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::566f7a820449cd017aa0958e70c2a284
https://doi.org/10.1088/0960-1317/16/10/024

المؤلفون: Chih-Kuang Yu, Ming-Che Hsieh, Sheng-Tsai Wu

المصدر: 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

مصطلحات موضوعية: Stress (mechanics), Materials science, Thermal conductivity, Through-silicon via, business.industry, Thermal resistance, Stacking, Mechanical engineering, Junction temperature, Structural engineering, Integrated circuit packaging, business, Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::06aea62b18997d4d6bb370ac735e65f6
https://doi.org/10.1109/stherm.2010.5444314

المؤلفون: Ming-Ji Dai, Chun-Kai Liu, Chih-Kuang Yu, Ming-Che Hsieh, Ra-Min Tain

المصدر: ASME 2009 InterPACK Conference, Volume 2.

مصطلحات موضوعية: Finite volume method, Materials science, Silicon, Physics::Instrumentation and Detectors, chemistry.chemical_element, Die (integrated circuit), Thermal transmittance, Thermal conductivity, chemistry, Heat transfer, Thermal, Electronic engineering, Junction temperature, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0c54d5f01328b939aca08bf20ce014e6
https://doi.org/10.1115/interpack2009-89242