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1مؤتمر
المؤلفون: Ming-Che Hsieh, Chih-Kuang Yu
المصدر: EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. :1-7 Apr, 2008
Relation: 2008 Intl. Conf. on Thermal, Mechanical & Multi-Physics simulation and Experiments in Microelectronics
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2مؤتمر
المؤلفون: Chun Kai Liu, Ming-Ji Dai, Chih-Kuang Yu, Sheng-Liang Kuo
المصدر: 2007 International Microsystems, Packaging, Assembly and Circuits Technology Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International. :29-33 Oct, 2007
Relation: 2007 International Microsystems, Packaging, Assembly and Circuits Technology
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3مؤتمر
المؤلفون: Chun-Kai Liu, Chih-Kuang Yu, Chung-Yen Hsu, Sheng-Liang Kuo, Ming-Ji Dai
المصدر: 2007 International Microsystems, Packaging, Assembly and Circuits Technology Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International. :88-92 Oct, 2007
Relation: 2007 International Microsystems, Packaging, Assembly and Circuits Technology
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4مؤتمر
المؤلفون: Chih-Kuang Yu, Chun-Kai Liu, Ming-Ji Dai, Sheng-Liang Kuo, Chung-Yen Hsu
المصدر: 2007 26th International Conference on Thermoelectrics Thermoelectrics, 2007. ICT 2007. 26th International Conference on. :274-278 Jun, 2007
Relation: 2007 26th International Conference on Thermoelectrics (ICT 2007)
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5
المؤلفون: Mei-Jiau Huang, Tai-Ming Chang, Chun-Kai Liu, Chih-Kuang Yu
المصدر: International Journal of Heat and Mass Transfer. 51:4470-4479
مصطلحات موضوعية: Fluid Flow and Transfer Processes, Debye sheath, Condensed matter physics, Phonon, Mechanical Engineering, Condensed Matter Physics, symbols.namesake, Normal mode, Dispersion relation, symbols, Einstein solid, Debye function, Debye model, Debye length
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6
المؤلفون: Ding Chong Lu, Chih Kuang Yu
المصدر: International Journal of Heat and Mass Transfer. 50:3624-3637
مصطلحات موضوعية: Fluid Flow and Transfer Processes, Materials science, Fin, Critical heat flux, Mechanical Engineering, Bubble, Thermodynamics, Heat transfer coefficient, Condensed Matter Physics, Annular fin, Heat flux, Boiling, Heat transfer, Composite material
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7
المؤلفون: Chun-Kai Liu, Mei-Jiau Huang, Wen-Yen Chong, Chih-Kuang Yu, Tai-Ming Chang
المصدر: International Journal of Heat and Mass Transfer. 50:67-74
مصطلحات موضوعية: Fluid Flow and Transfer Processes, Materials science, Phonon scattering, Condensed matter physics, Phonon, business.industry, Mechanical Engineering, Boundary (topology), Condensed Matter Physics, symbols.namesake, Semiconductor, Scattering rate, Phase (matter), symbols, Thin film, business, Debye model
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8
المؤلفون: Ding Chong Lu, Tsung Chieh Cheng, Chih Kuang Yu
المصدر: Journal of Micromechanics and Microengineering. 16:2092-2099
مصطلحات موضوعية: Flow visualization, Chemistry, Critical heat flux, Mechanical Engineering, Liquid dielectric, Thermodynamics, Heat transfer coefficient, Electronic, Optical and Magnetic Materials, Heat flux, Mechanics of Materials, Boiling, Heat transfer, Electrical and Electronic Engineering, Composite material, Nucleate boiling
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9
المؤلفون: Chih-Kuang Yu, Ming-Che Hsieh, Sheng-Tsai Wu
المصدر: 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
مصطلحات موضوعية: Stress (mechanics), Materials science, Thermal conductivity, Through-silicon via, business.industry, Thermal resistance, Stacking, Mechanical engineering, Junction temperature, Structural engineering, Integrated circuit packaging, business, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::06aea62b18997d4d6bb370ac735e65f6
https://doi.org/10.1109/stherm.2010.5444314 -
10
المؤلفون: Ming-Ji Dai, Chun-Kai Liu, Chih-Kuang Yu, Ming-Che Hsieh, Ra-Min Tain
المصدر: ASME 2009 InterPACK Conference, Volume 2.
مصطلحات موضوعية: Finite volume method, Materials science, Silicon, Physics::Instrumentation and Detectors, chemistry.chemical_element, Die (integrated circuit), Thermal transmittance, Thermal conductivity, chemistry, Heat transfer, Thermal, Electronic engineering, Junction temperature, Composite material
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0c54d5f01328b939aca08bf20ce014e6
https://doi.org/10.1115/interpack2009-89242