المؤلفون: Shuang Zhao, Bing Zheng, Donglin Zhang, Xiaochen Xie, Zhibo Qu, Yong Wang, Xiuchen Zhao, Chin C. Lee, Yongjun Huo

المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 4600-4611 (2024)

مصطلحات موضوعية: Silver-based solid solution, Enhanced plasticity, The first principles calculations, Generalized planar fault energy, Electronic origin, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785424009608; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/611aec59c6bf4edca8efe873f4b99db7

المؤلفون: Shuang Zhao, Bing Zheng, Donglin Zhang, Xiaochen Xie, Zhibo Qu, Yong Wang, Xiuchen Zhao, Jiaqi Wu, Chin C. Lee, Yongjun Huo

المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 6065-6075 (2023)

مصطلحات موضوعية: Solid-state bonding, Solid solution softening, Generalized planar fault energy, Microelectronics packaging, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423009092; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/558058b43d9f4b448565f2e856c6158b

المؤلفون: Modi, N., Farahani, E.M., Jalali, A., Ramamurthy, J., Chin, C., Soetantijo, B.

المصدر: IEEE Transactions on Power Delivery IEEE Trans. Power Delivery Power Delivery, IEEE Transactions on. 39(3):1399-1406 Jun, 2024

المؤلفون: Ooi, B., Lee, W., Shubert, M.J.W., Ooi, Y., Chin, C., Woo, W.

المصدر: IEEE Transactions on Industry Applications IEEE Trans. on Ind. Applicat. Industry Applications, IEEE Transactions on. 59(3):3121-3132 Jun, 2023

المؤلفون: Kang, M. S.^{Aff1, IDs13415024011632_cor1}, Yu-Chin, C.

المصدر: Cognitive, Affective, & Behavioral Neuroscience. 24(3):402-420

المؤلفون: Adleberg, J.^{Aff1, IDs10278023009551_cor1}, Benitez, C. L., Primiano, N., Patel, A., Mogel, D., Kalra, R., Adhia, A., Berns, M., Chin, C., Tanghe, S., Yi, P., Zech, J., Kohli, A., Martin-Carreras, T., Corcuera-Solano, I., Huang, M., Ngeow, J.

المصدر: Journal of Imaging Informatics in Medicine. 37(2):601-610

المؤلفون: Ahmed, T.H., Tiang, J.J., Mahmud, A., Gwo-Chin, C., Do, D.

المصدر: IEEE Access Access, IEEE. 11:126482-126506 2023

المؤلفون: So, C. H. F.^Aff17, Chin, C. M. M.^Aff17, Sakundarini, N.^Aff17

المساهمون: Kacprzyk, Janusz, Series Editor^Aff1, Gomide, Fernando, Advisory Editor^Aff2, Kaynak, Okyay, Advisory Editor^Aff3, Liu, Derong, Advisory Editor^Aff4, Pedrycz, Witold, Advisory Editor^Aff5, Polycarpou, Marios M., Advisory Editor^Aff6, Rudas, Imre J., Advisory Editor^Aff7, Wang, Jun, Advisory Editor^Aff8, Tan, Andrew, editor^Aff9, Zhu, Fan, editor^Aff10, Jiang, Haochuan, editor^Aff11, Mostafa, Kazi, editor^Aff12, Yap, Eng Hwa, editor^Aff13, Chen, Leo, editor^Aff14, Olule, Lillian J. A., editor^Aff15, Myung, Hyun, editor^Aff16

المصدر: Advances in Intelligent Manufacturing and Robotics : Selected Articles from ICIMR 2023; 22-23 August, Suzhou, China. 845:235-250

المؤلفون: Wang X, Chin C S, Xia J

المصدر: MATEC Web of Conferences, Vol 206, p 02004 (2018)

مصطلحات موضوعية: Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2261-236X

URL الوصول: https://doaj.org/article/ba3f1c3e6cc041d9ac579480650abbd8

المؤلفون: Koh S K, Chin C H, Tan Y F, Teoh L E, Pooi A H, Goh Y K

المصدر: MATEC Web of Conferences, Vol 189, p 02006 (2018)

مصطلحات موضوعية: Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2261-236X

URL الوصول: https://doaj.org/article/250b0d7a4a16418babc15fe698ff1f20