المؤلفون: Shuang Zhao, Bing Zheng, Donglin Zhang, Xiaochen Xie, Zhibo Qu, Yong Wang, Xiuchen Zhao, Chin C. Lee, Yongjun Huo

المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 4600-4611 (2024)

مصطلحات موضوعية: Silver-based solid solution, Enhanced plasticity, The first principles calculations, Generalized planar fault energy, Electronic origin, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785424009608; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/611aec59c6bf4edca8efe873f4b99db7

المؤلفون: Shuang Zhao, Bing Zheng, Donglin Zhang, Xiaochen Xie, Zhibo Qu, Yong Wang, Xiuchen Zhao, Jiaqi Wu, Chin C. Lee, Yongjun Huo

المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 6065-6075 (2023)

مصطلحات موضوعية: Solid-state bonding, Solid solution softening, Generalized planar fault energy, Microelectronics packaging, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423009092; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/558058b43d9f4b448565f2e856c6158b

المؤلفون: Jeong Park, Kakovitch, D., Moo whan Shin, Chin C. Lee

المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :438-442 2003

Relation: 53rd Electronic Components and Technology Conference, 2003. Proceedings.

المؤلفون: Dongwook Kim, Chin C. Lee

المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :668-672 2003

Relation: 53rd Electronic Components and Technology Conference, 2003. Proceedings.

المؤلفون: Dongwook Kim, Chin C. Lee, Sokolowski, W.M.

المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :840-843 2003

Relation: 53rd Electronic Components and Technology Conference, 2003. Proceedings.

المؤلفون: Chien, D.H., Chin C. Lee, Rachlin, M., Peake, A., Kole, T.

المصدر: Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings Semiconductor thermal measurement and management Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE. :89-96 1996

Relation: Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings

المؤلفون: Chen S. Tsai, Jun Su, Chin C. Lee, Mills, D.L.

المصدر: IEEE International Magnetics Conference Magnetics Conference, 1999. Digest of INTERMAG 99. 1999 IEEE International. :BE08-BE08 1999

Relation: IEEE International Magnetics Conference

المؤلفون: Taiyu Wang, Songzhao Gu, Yexing Fang, Donglin Zhang, Xiaochen Xie, Zhibo Qu, Yong Wang, Xiuchen Zhao, Jiaqi Wu, Chin C. Lee, Yongjun Huo

المصدر: Materials Characterization. 199:112830

مصطلحات موضوعية: Mechanics of Materials, Mechanical Engineering, General Materials Science, Condensed Matter Physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::91e92b459c097c6d177174c1eb5e5cfe
https://doi.org/10.1016/j.matchar.2023.112830

المؤلفون: Armin Kiankhooy, Khuyen Do, Philip M. Chang, Chin C. Lee, Rahul N. Doshi

المصدر: HeartRhythm Case Reports

مصطلحات موضوعية: Device management, medicine.medical_specialty, business.industry, medicine.medical_treatment, ICD, Case Report, Implantable cardioverter-defibrillator, Inappropriate shocks, Subcutaneous implantable cardioverter-defibrillator, medicine, SICD, Adult congenital heart disease, Cardiology and Cardiovascular Medicine, Intensive care medicine, Lead Placement, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ef685e7bcea71f067e7731516e51b21c
http://europepmc.org/articles/PMC6701193

المؤلفون: Chin C. Lee, Shao-Wei Fu

المصدر: Journal of Alloys and Compounds. 774:1207-1215

مصطلحات موضوعية: Materials science, Mechanical Engineering, Metals and Alloys, chemistry.chemical_element, 02 engineering and technology, Substrate (electronics), 010402 general chemistry, 021001 nanoscience & nanotechnology, 01 natural sciences, Die (integrated circuit), 0104 chemical sciences, Thermal conductivity, chemistry, Mechanics of Materials, Aluminium, Materials Chemistry, Eutectic bonding, Composite material, 0210 nano-technology, Layer (electronics), FOIL method, Eutectic system

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6a2d7a75bebeb047b70729f38e640f2f
https://doi.org/10.1016/j.jallcom.2018.09.254