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1دورية أكاديمية
المؤلفون: Wei Chen Huang, Chin Hao Tsai, Pei Tzu Lee, C.R. Kao
المصدر: Journal of Materials Research and Technology, Vol 19, Iss , Pp 3828-3841 (2022)
مصطلحات موضوعية: Power device packaging, Interconnection, Die attach, Ag–Sn alloy Sintering, Cu–Sn intermetallic Compound, Mechanical properties, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Han-Tang Hung, Fu-Ling Chang, Chin-Hao Tsai, Chia-Yi Liao, C. R. Kao
المصدر: Materials, Vol 16, Iss 18, p 6263 (2023)
مصطلحات موضوعية: low melting-point solder, interfacial reaction, In, CuIn2, intermetallic compounds, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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3دورية أكاديمية
المؤلفون: Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Jiahui Li, Hiroshi Nishikawa, C.R. Kao
المصدر: Journal of Materials Research and Technology, Vol 15, Iss , Pp 4541-4553 (2021)
مصطلحات موضوعية: Interconnection, Die attachment, Micro-Ag sintering, Ag–In intermetallic compounds, Transient liquid phase bonding, Mechanical properties, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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4دورية أكاديمية
المؤلفون: Chin-Hao Tsai, Wei-Chen Huang, Chengheng Robert Kao
المصدر: Materials, Vol 15, Iss 4, p 1397 (2022)
مصطلحات موضوعية: Ag–In alloy pastes, mechanical alloying, power semiconductor packaging, die attachment, mechanical properties, oxidation mechanism, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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5
المؤلفون: Chin-Hao Tsai, Han-Tang Hung, Fu-Ling Chang, Steffen Bickel, Maik Müller, Iuliana Panchenko, Karlheinz Bock, C.R. Kao
المصدر: Journal of Materials Research and Technology. 19:2510-2515
مصطلحات موضوعية: Biomaterials, Metals and Alloys, Ceramics and Composites, Surfaces, Coatings and Films
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6
المؤلفون: Chin-Hao Tsai, Felix Steiner, Dai Ishikawa, C. Robert Kao, Thomas Blank
المصدر: 2023 International Conference on Electronics Packaging (ICEP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9f437c37ad01b5d5941b97cc2dc260f3
https://doi.org/10.23919/icep58572.2023.10129697 -
7
المؤلفون: Hiroshi Nishikawa, Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, C. R. Kao, Jiahui Li
المصدر: Journal of Materials Research and Technology, Vol 15, Iss, Pp 4541-4553 (2021)
مصطلحات موضوعية: business.product_category, Materials science, Intermetallic, chemistry.chemical_element, Sintering, Mechanical properties, Temperature cycling, Biomaterials, Micro-Ag sintering, Composite material, Mining engineering. Metallurgy, Ag–In intermetallic compounds, Metals and Alloys, TN1-997, Copper, Interconnection, Surfaces, Coatings and Films, Power (physics), Die attachment, chemistry, Transient liquid phase bonding, Ceramics and Composites, Die (manufacturing), business, Indium, Solid solution
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8
المؤلفون: Wei-Chen Huang, Chin-Hao Tsai, C. R. Kao
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cfbb4dae2e7eb9dc9a05134af5b3ea00
https://doi.org/10.1109/estc55720.2022.9939385 -
9
المؤلفون: Chin-Hao Tsai, Wei-Chen Huang, Chengheng Robert Kao
المصدر: Materials; Volume 15; Issue 4; Pages: 1397
مصطلحات موضوعية: Ag–In alloy pastes, mechanical alloying, power semiconductor packaging, die attachment, mechanical properties, oxidation mechanism, General Materials Science
وصف الملف: application/pdf
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10
المؤلفون: C. Robert Kao, Chin Hao Tsai, Pei Tzu Lee, Sze Yin Lin
المصدر: Intermetallics. 138:107342
مصطلحات موضوعية: Materials science, Mechanical Engineering, Metals and Alloys, Intermetallic, Stacking, General Chemistry, Adhesion, Microstructure, Spall, Surface energy, Mechanics of Materials, Materials Chemistry, Composite material, Layer (electronics), Wetting layer