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1مؤتمر
المؤلفون: Keng-Jung, Pai, Chin-Hung, Kuo, Cheng-Yen, Wu, Peng, Jia-Wei, Huang, Chao-Yi, Chen, Jong-Chen
المصدر: 2021 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW) Consumer Electronics-Taiwan (ICCE-TW), 2021 IEEE International Conference on. :1-2 Sep, 2021
Relation: 2021 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)
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2دورية أكاديمية
المؤلفون: Chun-Cheng Lin, Der-Jiunn Deng, Chin-Hung Kuo, Linnan Chen
المصدر: IEEE Access, Vol 7, Pp 56198-56207 (2019)
مصطلحات موضوعية: Ensemble learning, imbalance data, concept drift, data adaption, smart manufacturing, Industry 4.0, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
وصف الملف: electronic resource
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3
المؤلفون: Der-Jiunn Deng, Chun-Cheng Lin, Chin-Hung Kuo, Linnan Chen
المصدر: IEEE Access, Vol 7, Pp 56198-56207 (2019)
مصطلحات موضوعية: General Computer Science, Concept drift, Computer science, Big data, 02 engineering and technology, Machine learning, computer.software_genre, concept drift, data adaption, Ensemble learning, 0202 electrical engineering, electronic engineering, information engineering, General Materials Science, smart manufacturing, imbalance data, business.industry, General Engineering, 020206 networking & telecommunications, Industry 4.0, Statistical classification, ComputingMethodologies_PATTERNRECOGNITION, 020201 artificial intelligence & image processing, Artificial intelligence, lcsh:Electrical engineering. Electronics. Nuclear engineering, business, Classifier (UML), computer, lcsh:TK1-9971
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b5c16d7a9b6858da1687f5f96c214a13
https://ieeexplore.ieee.org/document/8694986/
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4
المؤلفون: Chin-Hung Kuo, Bi-Wen Lee, Jung Wei Chen, Cheng Haw Lee
المصدر: 2018 IEEE International Conference on Advanced Manufacturing (ICAM).
مصطلحات موضوعية: Toxicology, Agricultural irrigation, Hot spring, chemistry, business.industry, Greenhouse gas, Environmental science, chemistry.chemical_element, Electricity, business, Carbon
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4d7ef28648b256e31a6f3192d529c876
https://doi.org/10.1109/amcon.2018.8614900 -
5
المؤلفون: Tsung-Hsun Yang, Cheng-En Ho, Ho-Yang Chan, Chin-Hung Kuo, Kuen-Song Lin, Hsin-Hui Hua
المصدر: Microelectronics Reliability. 53:2012-2017
مصطلحات موضوعية: Materials science, Kirkendall effect, Metallurgy, Condensed Matter Physics, Microstructure, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Electroless nickel, Printed circuit board, Organic solderability preservative, Soldering, Ultimate tensile strength, Electrical and Electronic Engineering, Wave soldering, Safety, Risk, Reliability and Quality
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