المؤلفون: Qun-Yi Nian, Chun-An Cheng, Li-Hsiang Cheng, Yuan-Yung Lin, Chin-Hung Wang, Wu-Chien Chien, Yueng-Hsiang Chu, Cheng-Ping Shih, Chao-Yin Kuo, Hsin-Chien Chen, Jih-Chin Lee, Chi-Hsiang Chung, Wei-Chuan Shangkuan, Hung-Che Lin

المصدر: Journal of Translational Medicine, Vol 22, Iss 1, Pp 1-15 (2024)

مصطلحات موضوعية: Psychiatric disorder, Hearing loss, Risk factor, Population-based retrospective cohort study, Medicine

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1479-5876

URL الوصول: https://doaj.org/article/b84ad57b903249b8915b4c29a392d3b6

المؤلفون: Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen

المصدر: Materials, Vol 15, Iss 5, p 1888 (2022)

مصطلحات موضوعية: Cu/SiO2 hybrid bonding, highly (111)-nanotwinned Cu, low temperature bonding, microelectronic packaging, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/15/5/1888; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/277bad7c4c904d249e62bf45845afc01

المؤلفون: Ming-Chih Yew, Chin-Wen Huang, Wei-Jr Lin, Chin-Hung Wang, Pin Chang

المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :323-326 Oct, 2009

Relation: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Cheng-Hsin Chunag, Yu-Chi Chen, You-Ming Hsu, Huei-Sheng Huang, Fei-Bin Hsiao, Chin-Hung Wang

المصدر: 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on. :854-857 Jan, 2009

Relation: 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

المؤلفون: Cheng-Hsin Chuang, Ching-Hua Wei, You-Ming Hsu, Hsiang-Ching Chen, Chin-Hung Wang

المصدر: 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on. :858-863 Jan, 2008

Relation: 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

المؤلفون: Fei-Bin Hsiao, Chun-Ping Jen, Hung-Ying Chen, Hsiu-Lan Hsu, Yung-Chun Lee, Cheng-Hsin Chuang, Chin-Hung Wang

المصدر: 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on. :951-954 Jan, 2008

Relation: 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

المؤلفون: Shih-Chi Yang, Jia-Juen Ong., Dinh-Phuc Tran, Wei-Lan Chiu, Ou-Hsing Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Chih Chen

المصدر: 2023 International Conference on Electronics Packaging (ICEP).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::006b89dc32a9b277cf53d110fb93b01b
https://doi.org/10.23919/icep58572.2023.10129678

المؤلفون: Jie Zhang, Wei Lu, Po-Tsang Huang, Sih-Han Li, Tsung-Yi Hung, Shih-Hsien Wu, Ming-Ji Dai, I-Shan Chung, Wen-Chao Chen, Chin-Hung Wang, Shyh-Shyuan Sheu, Hung-Ming Chen, Kuan-Neng Chen, Wei-Chung Lo, Chih-I Wu

المصدر: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0a524cd560c088d05dfa87f0efe51b16
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830188

المؤلفون: Jia-Juen, Ong, Wei-Lan, Chiu, Ou-Hsiang, Lee, Chia-Wen, Chiang, Hsiang-Hung, Chang, Chin-Hung, Wang, Kai-Cheng, Shie, Shih-Chi, Yang, Dinh-Phuc, Tran, King-Ning, Tu, Chih, Chen

المصدر: Materials (Basel, Switzerland). 15(5)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=pmid________::196f655c09d9a6de01c11344cafc836b
https://pubmed.ncbi.nlm.nih.gov/35269118

المؤلفون: Erhard Kohn, Chin Hung Wang, Jun Kai Mao, Changwei Chen, Yonhua Tzeng

المصدر: Diamond and Related Materials. 20:546-550

مصطلحات موضوعية: Microelectromechanical systems, Materials science, Synthetic diamond, business.industry, Orders of magnitude (temperature), Mechanical Engineering, Capacitive sensing, General Chemistry, Dielectric, Electrostatics, Electronic, Optical and Magnetic Materials, law.invention, law, Materials Chemistry, Optoelectronics, Electrical and Electronic Engineering, business, Nanodiamond, Voltage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3d5d5e7406c25a90eb3266c31274265b
https://doi.org/10.1016/j.diamond.2011.02.008