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1دورية أكاديمية
المؤلفون: Qun-Yi Nian, Chun-An Cheng, Li-Hsiang Cheng, Yuan-Yung Lin, Chin-Hung Wang, Wu-Chien Chien, Yueng-Hsiang Chu, Cheng-Ping Shih, Chao-Yin Kuo, Hsin-Chien Chen, Jih-Chin Lee, Chi-Hsiang Chung, Wei-Chuan Shangkuan, Hung-Che Lin
المصدر: Journal of Translational Medicine, Vol 22, Iss 1, Pp 1-15 (2024)
مصطلحات موضوعية: Psychiatric disorder, Hearing loss, Risk factor, Population-based retrospective cohort study, Medicine
وصف الملف: electronic resource
Relation: https://doaj.org/toc/1479-5876
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2دورية أكاديمية
المؤلفون: Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen
المصدر: Materials, Vol 15, Iss 5, p 1888 (2022)
مصطلحات موضوعية: Cu/SiO2 hybrid bonding, highly (111)-nanotwinned Cu, low temperature bonding, microelectronic packaging, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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3مؤتمر
المؤلفون: Ming-Chih Yew, Chin-Wen Huang, Wei-Jr Lin, Chin-Hung Wang, Pin Chang
المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :323-326 Oct, 2009
Relation: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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4مؤتمر
المؤلفون: Cheng-Hsin Chunag, Yu-Chi Chen, You-Ming Hsu, Huei-Sheng Huang, Fei-Bin Hsiao, Chin-Hung Wang
المصدر: 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on. :854-857 Jan, 2009
Relation: 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
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5مؤتمر
المصدر: 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on. :858-863 Jan, 2008
Relation: 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
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6مؤتمر
المؤلفون: Fei-Bin Hsiao, Chun-Ping Jen, Hung-Ying Chen, Hsiu-Lan Hsu, Yung-Chun Lee, Cheng-Hsin Chuang, Chin-Hung Wang
المصدر: 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on. :951-954 Jan, 2008
Relation: 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
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7
المؤلفون: Shih-Chi Yang, Jia-Juen Ong., Dinh-Phuc Tran, Wei-Lan Chiu, Ou-Hsing Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Chih Chen
المصدر: 2023 International Conference on Electronics Packaging (ICEP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::006b89dc32a9b277cf53d110fb93b01b
https://doi.org/10.23919/icep58572.2023.10129678 -
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المؤلفون: Jie Zhang, Wei Lu, Po-Tsang Huang, Sih-Han Li, Tsung-Yi Hung, Shih-Hsien Wu, Ming-Ji Dai, I-Shan Chung, Wen-Chao Chen, Chin-Hung Wang, Shyh-Shyuan Sheu, Hung-Ming Chen, Kuan-Neng Chen, Wei-Chung Lo, Chih-I Wu
المصدر: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0a524cd560c088d05dfa87f0efe51b16
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830188 -
9
المؤلفون: Jia-Juen, Ong, Wei-Lan, Chiu, Ou-Hsiang, Lee, Chia-Wen, Chiang, Hsiang-Hung, Chang, Chin-Hung, Wang, Kai-Cheng, Shie, Shih-Chi, Yang, Dinh-Phuc, Tran, King-Ning, Tu, Chih, Chen
المصدر: Materials (Basel, Switzerland). 15(5)
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10
المؤلفون: Erhard Kohn, Chin Hung Wang, Jun Kai Mao, Changwei Chen, Yonhua Tzeng
المصدر: Diamond and Related Materials. 20:546-550
مصطلحات موضوعية: Microelectromechanical systems, Materials science, Synthetic diamond, business.industry, Orders of magnitude (temperature), Mechanical Engineering, Capacitive sensing, General Chemistry, Dielectric, Electrostatics, Electronic, Optical and Magnetic Materials, law.invention, law, Materials Chemistry, Optoelectronics, Electrical and Electronic Engineering, business, Nanodiamond, Voltage