المؤلفون: Hsia, H., Tsai, C.H., Ting, K.C., Kuo, F.W., Lin, C.C., Wang, C.T., Hou, S.Y., Chiou, W.C., Yu, Douglas C.H.

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :263-268 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Chen, M.F., Tsai, C.H., Ku, T., Chiou, W.C., Wang, C.T., Yu, D.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 67(12):5343-5348 Dec, 2020

المؤلفون: Hou, S.Y., Chen, W.C., Hu, C., Chiu, C., Ting, K.C., Lin, T.S., Wei, W.H., Chiou, W.C., Lin, V.J.C., Chang, V.C.Y., Wang, C.T., Wu, C.H., Yu, D.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 64(10):4071-4077 Oct, 2017

المؤلفون: Hou, S.Y., Hsia, H., Tsai, C.H., Ting, K.C., Yu, T.H., Lee, Y.W., Chen, F.C., Chiou, W.C., Wang, C.T., Wu, C.H., Yu, Douglas

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :19.5.1-19.5.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Hu, C.C., Chen, M.F., Chiou, W.C., Yu, Doug C.H.

المصدر: 2019 Symposium on VLSI Technology VLSI Technology, 2019 Symposium on. :T20-T21 Jun, 2019

Relation: 2019 Symposium on VLSI Technology

المؤلفون: Chiou, W.C., Chen, Y.H., Lee, S.N., Jeng, S.M., Jang, S.M., Liang, M.S.

المصدر: Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :127-129 2004

Relation: Proceedings of the IEEE 2004 International Interconnect Technology Conference

المؤلفون: Liao, W.S., Chiang, C.C., Wu, W.M., Fan, C. H., Chiu, S.L., Chiu, C.C., Chen, T.Y., Hsieh, C.C., Chen, H.Y., Lo, H.Y., Huang, L.C., Wu, T.J., Chiou, W.C., Hou, S.Y., Jeng, S.P., Doug Yu

المصدر: 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on. :1-2 Jun, 2014

Relation: 2014 IEEE Symposium on VLSI Technology

المؤلفون: Yota, J., Janani, M., Camilletti, L.E., Kar-Roy, A., Liu, Q.Z., Nguyen, C., Woo, M.D., Hander, J., van Cleemput, P., Chang, W., Chiou, W.C., Li, L.J., Chao, L.C., Jang, S.M., Yu, C.H., Liang, M.S.

المصدر: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) Interconnect technology Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International. :76-78 2000

Relation: Proceedings of the IEEE 2000 International Interconnect Technology Conference

المؤلفون: Chen, D.Y., Chiou, W.C., Chen, M.F., Wang, T.D., Ching, K.M., Tu, H.J., Wu, W.J., Yu, C.L., Yang, K.F., Chang, H.B., Tseng, M.H., Hsiao, C.W., Lu, Y.J., Hu, H.P., Lin, Y.C., Hsu, C.S., Shue, Winston S., Yu, C.H.

المصدر: 2009 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2009 IEEE International. :1-4 Dec, 2009

Relation: 2009 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Chiou, W.C., Yu, C.H.

المصدر: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International. :371-374 Oct, 2008

Relation: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT)