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1مؤتمر
المصدر: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2020 IEEE 26th International Symposium for. :202-205 Oct, 2020
Relation: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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2مؤتمر
المؤلفون: Vasile, Daniel-Ciprian, Chitu, Sorin, Svasta, Paul
المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-6 Sep, 2020
Relation: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
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3مؤتمر
المصدر: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2020 IEEE 26th International Symposium for. :106-108 Oct, 2020
Relation: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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4مؤتمر
المؤلفون: Vuza, Dan Tudor, Chitu, Sorin, Svasta, Paul
المصدر: 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for. :53-58 Sep, 2010
Relation: 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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5مؤتمر
المؤلفون: Vuza, Dan Tudor, Chitu, Sorin, Svasta, Paul
المصدر: 33rd International Spring Seminar on Electronics Technology, ISSE 2010 Electronics Technology (ISSE), 2010 33rd International Spring Seminar on. :427-432 May, 2010
Relation: 2010 33rd International Spring Seminar on Electronics Technology (ISSE)