المؤلفون: Liu, Yangming, Wang, Xu, Liu, Xiangyang, Huang, Shenghua, Chiu, Chin-Tien, Ye, Ning, Yang, Bo

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :513-518 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Liu, Yangming, Ji, Zhongli, Chen, Peng, Wang, Xu, Ye, Ning, Chiu, Chin-Tien

المصدر: 2016 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2016 IEEE. :217-220 Nov, 2016

Relation: 2016 IEEE CPMT Symposium Japan (ICSJ)

المؤلفون: Ye, Ning, Li, Qing, Zhang, Huirong, Ji, Zhongli, Yang, Xiaoyu, Chiu, Chin-Tien, Takiar, Hem

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1840-1846 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

المؤلفون: Ma, Shineng, Yu, Xiang, Bai, Ye, Qian, Kaiyou, Chiu, Chin-Tien

المصدر: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :188-190 Oct, 2016

Relation: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)