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1مؤتمر
المؤلفون: Wu, T.-F., Lee, P.-C., Chiu, J.-Y., Hung, C.-C.
المصدر: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024 IEEE 10th International. :300-304 May, 2024
Relation: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
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2دورية أكاديمية
المصدر: IEEE Transactions on Industry Applications IEEE Trans. on Ind. Applicat. Industry Applications, IEEE Transactions on. 60(3):4201-4212 Jun, 2024
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3تقرير
المؤلفون: van Leeuwen, Peter Jan, Chiu, J. Christine, Yang, C. Kevin
مصطلحات موضوعية: Computer Science - Machine Learning, Statistics - Machine Learning, 62D99, G.3
URL الوصول: http://arxiv.org/abs/2405.20550
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4دورية أكاديمية
المؤلفون: Wu, T., Sakavov, T., Hung, C., Chiu, J.
المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 38(12):14930-14941 Dec, 2023
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5دورية أكاديمية
المصدر: IEEE Transactions on Industry Applications IEEE Trans. on Ind. Applicat. Industry Applications, IEEE Transactions on. 59(5):6220-6231 Jan, 2023
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6دورية أكاديمية
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(8):4194-4197 Aug, 2023
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7دورية أكاديمية
المؤلفون: Wu, S., Wei, S., Chang, C., Swindlehurst, A.L., Chiu, J.
المصدر: IEEE Transactions on Neural Networks and Learning Systems IEEE Trans. Neural Netw. Learning Syst. Neural Networks and Learning Systems, IEEE Transactions on. 34(8):4966-4980 Aug, 2023
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8دورية أكاديمية
المصدر: IEEE Open Journal of Industry Applications IEEE Open J. Ind. Applicat. Industry Applications, IEEE Open Journal of. 4:260-268 2023
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9مؤتمر300mm Full Thickness Si-Based IC Singulation Using Plasma Dicing for Advanced Packaging Technologies
المؤلفون: Surapaneni, R., Hamlin, B. S., Chiu, J., Brun, X. F., Barnett, R., Muggeridge, M., Bhasker, H., Richards, N.
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1019-1024 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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10دورية أكاديمية
المصدر: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 35(2):210-219 May, 2022