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Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المؤلفون: Park, Jae-Hyun, Lee, Ji-Young, Cho, Min-Kyo, Kim, Jae-June, Kim, Gu-Sung

المصدر: 2009 International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. :577-580 Aug, 2009

Relation: 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)