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1دورية أكاديمية
المؤلفون: Cheng, P. L., Leung, S. Y. Y., Law, T. W., Liu, C. K., Chong, J. I. T., Lam, D. C. C.
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 30(2):264-268 Jun, 2007
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2دورية أكاديمية
المؤلفون: Cheng, P. L., Leung, S. Y. Y., Law, T. W., Liu, C. K., Chong, J. I. T., Lam, D. C. C.
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 30(2):269-274 Jun, 2007
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