المؤلفون: Wang, Z.Y., Wong, T.N., Duan, F., Toh, K.C., Choo, K.F., Tan, S.P., Loh, C.V., Leong, Y.W.

المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :511-514 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

المؤلفون: Ling, J.H.L., Tay, A.A.O., Choo, K.F.

المصدر: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :1550-1555 Aug, 2012

Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

المؤلفون: Yan, Z.B., Duan, F., Wong, T.N., Toh, K.C., Choo, K.F., Chan, P.K., Chua, Y.S., Lee, L.W.

المصدر: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :76-78 Dec, 2010

Relation: 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

المؤلفون: Ng, C.Y.R., Wong, Y.W., Liu, C.Y., Choo, K.F.

المصدر: Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) Electronics packaging technology Electronics Packaging Technology Conference, 1998. Proceedings of 2nd. :143-146 1998

Relation: Proceedings of 2nd Electronics Packaging Technology Conference

المؤلفون: Han, Y., Lau, B.L., Zhang, X., Leong, Y.C., Choo, K.F.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 4(9):1441-1450 Sep, 2014

المؤلفون: Han, Y., Lau, B.L., Zhang, X., Leong, Y.C., Choo, K.F.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 4(6):983-990 Jun, 2014

المؤلفون: Xie, J.L., Tan, Y.B., Wong, T.N., Duan, F., Toh, K.C., Choo, K.F., Chan, P.K., Chua, Y.S.

المصدر: In International Journal of Heat and Mass Transfer November 2014 78:1177-1186

المؤلفون: Xie, J.L., Tan, Y.B., Duan, F., Ranjith, K., Wong, T.N., Toh, K.C., Choo, K.F., Chan, P.K.

المصدر: In Applied Thermal Engineering 25 September 2013 59(1-2):464-472

المؤلفون: Tan, Y.B., Xie, J.L., Duan, F., Wong, T.N., Toh, K.C., Choo, K.F., Chan, P.K., Chua, Y.S.

المصدر: In Applied Thermal Engineering 30 May 2013 54(2):372-379

المؤلفون: Yan, Z.B., Toh, K.C., Duan, F., Wong, T.N., Choo, K.F., Chan, P.K., Chua, Y.S.

المصدر: In Applied Thermal Engineering 2010 30(10):1225-1230