يعرض 1 - 10 نتائج من 49,996 نتيجة بحث عن '"Choong A"', وقت الاستعلام: 1.21s تنقيح النتائج
  1. 1
    مؤتمر
    Semi-Automatic Dough Weighing Machine for Enhanced Productivity in Quality Control Processes

    المؤلفون: Rahim, Nuranisa Suhada Binti Abd, Yang, Chuan Choong, Zulkarnain, Nur Dalilah binti, Hanif, Noor Hazrin Hany bt Mohamad

    المصدر: 2024 9th International Conference on Mechatronics Engineering (ICOM) Mechatronics Engineering (ICOM), 2024 9th International Conference on. :251-254 Aug, 2024

    Relation: 2024 9th International Conference on Mechatronics Engineering (ICOM)

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  2. 2
    دورية أكاديمية
    Metaverse for Wireless Systems: Vision, Enablers, Architecture, and Future Directions

    المؤلفون: Khan, Latif U., Han, Zhu, Niyato, Dusit, Guizani, Mohsen, Hong, Choong Seon

    المصدر: IEEE Wireless Communications IEEE Wireless Commun. Wireless Communications, IEEE. 31(4):245-251 Aug, 2024

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  3. 3
    دورية أكاديمية
    Convergence of Communications, Control, and Machine Learning for Secure and Autonomous Vehicle Navigation

    المؤلفون: Zeng, Tengchan, Ferdowsi, Aidin, Semiari, Omid, Saad, Walid, Hong, Choong Seon

    المصدر: IEEE Wireless Communications IEEE Wireless Commun. Wireless Communications, IEEE. 31(4):132-138 Aug, 2024

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  4. 4
    مؤتمر
    A Secure Data Sharing Platform in the Era of Web 3.0 by Leveraging the Power of Blockchain Technology

    المؤلفون: Ming Jie, Christensen Choong, Rajah, Daveena Sri A-P Michael, Ganisen, Gyvayhni A-P, Chandran, Tharanitharan A-L, Rafsanjani, Ahmad Sahban, Basheer Jasser, Muhammed

    المصدر: 2024 IEEE International Conference on Automatic Control and Intelligent Systems (I2CACIS) Automatic Control and Intelligent Systems (I2CACIS), 2024 IEEE International Conference on. :291-296 Jun, 2024

    Relation: 2024 IEEE International Conference on Automatic Control and Intelligent Systems (I2CACIS)

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  5. 5
    مؤتمر
    A Personalised Learning Tool for Physics Undergraduate Students Built On a Large Language Model for Symbolic Regression

    المؤلفون: Zhu, Yufan, Khoo, Zi-Yu, Choong Low, Jonathan Sze, Bressan, Stephane

    المصدر: 2024 IEEE Conference on Artificial Intelligence (CAI) CAI Artificial Intelligence (CAI), 2024 IEEE Conference on. :38-43 Jun, 2024

    Relation: 2024 IEEE Conference on Artificial Intelligence (CAI)

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  6. 6
    مؤتمر
    A Power Allocation Framework for Holographic MIMO-Aided Energy-Efficient Cell-Free Networks

    المؤلفون: Adhikary, Apurba, Raha, Avi Deb, Qiao, Yu, Park, Yu Min, Han, Zhu, Hong, Choong Seon

    المصدر: ICC 2024 - IEEE International Conference on Communications Communications, ICC 2024 - IEEE International Conference on. :5546-5552 Jun, 2024

    Relation: ICC 2024 - IEEE International Conference on Communications

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  7. 7
    مؤتمر
    Knowledge Distillation Assisted Robust Federated Learning: Towards Edge Intelligence

    المؤلفون: Qiao, Yu, Adhikary, Apurba, Kim, Ki Tae, Zhang, Chaoning, Hong, Choong Seon

    المصدر: ICC 2024 - IEEE International Conference on Communications Communications, ICC 2024 - IEEE International Conference on. :843-848 Jun, 2024

    Relation: ICC 2024 - IEEE International Conference on Communications

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  8. 8
    مؤتمر
    Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking

    المؤلفون: Kumar, Mishra Dileep, Nagendra Sekhar, Vasarla, Rao, B.S.S. Chandra, Choong Chong, Ser, Rao, Vempati Srinivasa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :614-619 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Impact of Current induced Joule heating variation on long-term Low melting temperature solder joint stability

    المؤلفون: Lee, Tae-Kyu, Park, Yujin, Ramakrishna, Gnyaneshwar, Gothe, Pushkar, Lee, Young-Woo, Kim, Hui-Joong, Lee, Seul-Gi, Kim, Choong-Un

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1439-1444 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding

    المؤلفون: Rao, B.S.S. Chandra, Kumar, Mishra Dileep, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Tippabhotla, Sasi Kumar, Chong, Ser Choong, C, Hemanth Kumar, Rao, Vempati Srinivasa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :62-68 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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