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1مؤتمر
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International. :1-4 Oct, 2010
Relation: 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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2مؤتمر
المؤلفون: Yang, Shin-Yueh, Chou, Tsung-Lin, Huang, Chien-Fu, Wu, Chung-Jung, Hsu, Chia-Liang, Chiang, Kuo-Ning
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International. :1-4 Oct, 2010
Relation: 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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3مؤتمر
المؤلفون: Yang, Shin-Yueh, Chou, Tsung-Lin, Huang, Chien-Fu, Chung-Jung Wu, Chia-Liang Hsu, Chiang, Kuo-Ning
المصدر: 3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-5 Sep, 2010
Relation: 2010 3rd Electronic System-Integration Technology Conference (ESTC)
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4مؤتمر
المؤلفون: Wang, Ning-Yuan, Chiang, Shih-Ying, Chou, Tsung-Lin, Shih, Zun-Hao, Hong, Hwen-Fen, Chiang, Kuo-Ning
المصدر: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. :1-6 Jun, 2010
Relation: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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5مؤتمر
المؤلفون: Chi, Wei-Hao, Chou, Tsung-Lin, Han, Cheng-Nan, Chiang, Kuo-Ning
المصدر: 2008 10th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th. :533-538 Dec, 2008
Relation: 2008 10th Electronics Packaging Technology Conference (EPTC)
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6دورية أكاديمية
المصدر: In Microelectronic Engineering 2011 88(5):785-790
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7دورية أكاديمية
المؤلفون: Chou, Tsung-Lin, Yang, Shin-Yueh, Chiang, Kuo-Ning
المصدر: In Thin Solid Films 2011 519(22):7883-7894
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8دورية أكاديمية
المصدر: In Microelectronic Engineering 2008 85(10):2079-2084
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9دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
10دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.