المؤلفون: Chen, M. H., Lin, Y. C., Chou, Y. C.

المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :107-108 Apr, 2023

Relation: 2023 International Conference on Electronics Packaging (ICEP)

المؤلفون: Chien, W. C., Gignac, L. M., Chou, Y. C., Yang, C. H., Gong, N., Ho, H. Y., Yeh, C. W., Cheng, H. Y., Kim, W., Kuo, I. T., Lai, E. K., Cheng, C. W., Buzi, L., Ray, A., Hsu, C. S., Daudelin, D., Bruce, R. L., BrightSky, M., Lung, H. L.

المصدر: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :327-329 Mar, 2022

Relation: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Si, X., Tu, Y.-N., Huang, W.-H., Su, J.-W., Lu, P.-J., Wang, J.-H., Liu, T.-W., Wu, S.-Y., Liu, R., Chou, Y.-C., Zhang, Z., Sie, S.-H., Wei, W.-C., Lo, Y.-C., Wen, T.-H., Hsu, T.-H., Chen, Y.-K., Shih, W., Lo, C.-C., Liu, R.-S., Hsieh, C.-C., Tang, K.-T., Lien, N.-C., Shih, W.-C., He, Y., Li, Q., Chang, M.-F.

المصدر: 2020 IEEE International Solid-State Circuits Conference - (ISSCC) Solid-State Circuits Conference - (ISSCC), 2020 IEEE International. :246-248 Feb, 2020

Relation: 2020 IEEE International Solid-State Circuits Conference - (ISSCC)

المؤلفون: Chien, W. C., Gignac, L. M., Chou, Y. C., Yang, C. H., Gong, N., Ho, H. Y., Yeh, C. W., Cheng, H. Y., Kim, W., Kuo, I. T., Lai, E. K., Cheng, C. W., Buzi, L., Ray, A., Hsu, C. S., Bruce, R. L., BrightSky, M., Lung, H. L.

المصدر: 2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :P7-1-P7-4 Mar, 2022

Relation: 2022 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Cheng, H. Y., Chien, W C., Kuo, I. T., Yang, C. H., Chou, Y. C., Bruce, R. L., Lai, E. K., Daudelin, D., Yeh, C. W., Gignac, L., Cheng, C. W., Grun, A., Lavoie, C., Gong, N., Buzi, L., Ho, H. Y., Ray, A., Utomo, H., BrightSky, M., Lung, H. L.

المصدر: 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :28.6.1-28.6.4 Dec, 2021

Relation: 2021 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Cheng, H. Y., Kuo, I. T., Chien, W. C., Yeh, C. W., Chou, Y. C., Gong, N., Gignac, L., Yang, C. H., Cheng, C. W., Lavoie, C., Hopstaken, M., Bruce, R. L., Buzi, L., Lai, E. K., Carta, F., Ray, A., Lee, M. H., Ho, H. Y., Kim, W., BrightSky, M., Lung, H. L.

المصدر: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020

Relation: 2020 IEEE Symposium on VLSI Technology

المؤلفون: Lee, M. H., Kuo, C.Y., Tang, C.-H., Chen, H.-H., Liao, C.-Y., Hong, R.-C., Gu, S-S., Chou, Y.-C., Wang, Z.-Y., Chen, S.-Y., Chen, P.-G., Liao, M.-H., Li, K.-S.

المصدر: 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2018 IEEE 2nd. :271-273 Mar, 2018

Relation: 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM)

المؤلفون: Chang, Y.-W., Yang, W.-C., Lo, W.-R., Lo, Z.-X., Ma, C.-H., Chu, Y.-H., Chou, Y.-C.

المصدر: In Materials Today Chemistry December 2022 26

المؤلفون: Lin, C.-F., Chou, Y.-C., Haung, J.-F., Chen, P.-H., Han, H.-C.

المصدر: 2015 22nd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD) Active-Matrix Flatpanel Displays and Devices (AM-FPD), 2015 22nd International Workshop on. :171-174 Jul, 2015

Relation: 2015 22nd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)

المؤلفون: Chen, P.-G., Chou, Y.-C., Gu, S.-S., Hong, R.-C., Wang, Z.-Y., Chen, S.-Y., Liao, C.-Y., Tang, M., Liao, M.-H., Lee, M. H.

المصدر: 2018 7th International Symposium on Next Generation Electronics (ISNE) Next Generation Electronics (ISNE), 2018 7th International Symposium on. :1-2 May, 2018

Relation: 2018 7th International Symposium on Next Generation Electronics (ISNE)