يعرض 1 - 10 نتائج من 72 نتيجة بحث عن '"Chu, Wei-Cheng"', وقت الاستعلام: 0.94s تنقيح النتائج
  1. 1
    مؤتمر
    Case Study For STI-LDNMOS Burned During HCI Stress to Passing Reliability Specifications

    المؤلفون: Chu, Wei-Cheng, Tsai, Bo-An, Yoshida, Hiroshi, Chen, Yi-Heng, Hsu, Yung-Lung

    المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-4 Jul, 2022

    Relation: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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  2. 2
    مؤتمر
    Analysis for the Physical Mechanism of the Abnormal Increase of Idsat in NMOS under HCI

    المؤلفون: Chu, Wei-Cheng, Tsai, Bo-An, Chen, Cheng-Te., Chang, Chi-Li, Lin, Wei-Fong

    المصدر: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021 IEEE International Symposium on the. :1-5 Sep, 2021

    Relation: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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  3. 3
    مؤتمر
    Physical Mechanism for Different Phases and Turn-Around of Idsat in PMOS under HCI Stress

    المؤلفون: Tsai, Bo-An, Chu, Wei-Cheng, Chang, Yu-Chih, Chen, Yi-Heng, Chen, Chien-Fu

    المصدر: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021 IEEE International Symposium on the. :1-6 Sep, 2021

    Relation: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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  4. 4
    مؤتمر
    Investigation of Saturated Drain Current Change Phases For PMOS HCI Stressed at Ibmax

    المؤلفون: Chu, Wei-Cheng, Tsai, B. A., Chen, Yi-Heng, Hsieh, Kun-Ham

    المصدر: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2020 IEEE International Symposium on the. :1-4 Jul, 2020

    Relation: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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  5. 5
    مؤتمر
    A study on the design factors of the bridal hairstyling by Analytic Hierarchy Process

    المؤلفون: Chiu, Shu-Ping, Wang, Ya-Chun, Chu, Wei-Cheng

    المصدر: 2018 IEEE International Conference on Advanced Manufacturing (ICAM) Advanced Manufacturing (ICAM), 2018 IEEE International Conference on. :359-361 Nov, 2018

    Relation: 2018 IEEE International Conference on Advanced Manufacturing (ICAM)

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  6. 6
    مؤتمر
    Evaluating Factors for Customer Churn of Hairdressing Industry Based on Modified Delphi Method

    المؤلفون: Chiu, Shu-Ping, Yang, Chi-Chung, Chu, Wei-Cheng

    المصدر: 2018 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW) Consumer Electronics-Taiwan (ICCE-TW), 2018 IEEE International Conference on. :1-2 May, 2018

    Relation: 2018 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)

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  7. 7
    مؤتمر
    Decentralized boundary detection without location information in wireless sensor networks

    المؤلفون: Chu, Wei-Cheng, Ssu, Kuo-Feng

    المصدر: 2012 IEEE Wireless Communications and Networking Conference (WCNC) Wireless Communications and Networking Conference (WCNC), 2012 IEEE. :1720-1724 Apr, 2012

    Relation: 2012 IEEE Wireless Communications and Networking Conference (WCNC)

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  8. 8
    مؤتمر
    RISE: RIpple Sink Exploration in wireless sensor network

    المؤلفون: Chu, Wei-Cheng, Ssu, Kuo-Feng

    المصدر: 2010 International Computer Symposium (ICS2010) Computer Symposium (ICS), 2010 International. :61-66 Dec, 2010

    Relation: 2010 International Computer Symposium (ICS 2010)

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  9. 9
    دورية أكاديمية
    Enhanced efficiency and stability of quasi-2D/3D perovskite solar cells by thermal assisted blade coating method

    المؤلفون: Lee, Kun-Mu, Chan, Shun-Hsiang, Hou, Min-Yao, Chu, Wei-Cheng, Chen, Shih-Hsuan, Yu, Sheng-Min, Wu, Ming-Chung

    المصدر: In Chemical Engineering Journal 1 February 2021 405

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  10. 10
    دورية أكاديمية
    Thermal assisted blade coating methylammonium lead iodide films with non-toxic solvent precursors for efficient perovskite solar cells and sub-module

    المؤلفون: Lee, Kun-Mu, Lai, Chia-Hsin, Chu, Wei-Cheng, Chan, Shun-Hsiang, Suryanarayanan, Vembu

    المصدر: In Solar Energy 1 July 2020 204:337-345

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