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1مؤتمر
المؤلفون: Xiaobin Yuan, Jae-Eun Park, Jing Wang, Enhai Zhao, Ahlgren, David, Hook, Terence, Jun Yuan, Chan, Victor, Huiling Shang, Chu-Hsin Liang, Lindsay, Richard, Sungjoon Park, Hyotae Choo
المصدر: 2007 IEEE International Integrated Reliability Workshop Final Report Integrated Reliability Workshop Final Report, 2007. IRW 2007. IEEE International. :70-73 Oct, 2007
Relation: 2007 IEEE International Integrated Reliability Workshop Final Report
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2
المؤلفون: David C. Ahlgren, Chu-Hsin Liang, Hyotae Choo, Victor Chan, Jun Yuan, Jae-Eun Park, Enhai Zhao, Xiaobin Yuan, R. Lindsay, Huiling Shang, Jing Wang, Terence B. Hook, Sung-Joon Park
المصدر: IEEE Transactions on Device and Materials Reliability. 8:501-508
مصطلحات موضوعية: Materials science, business.industry, Electrical engineering, Electron, Electronic, Optical and Magnetic Materials, CMOS, Electric field, MOSFET, Node (physics), Optoelectronics, Electrical and Electronic Engineering, Current (fluid), Safety, Risk, Reliability and Quality, business, Quantum tunnelling, Voltage
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3
المؤلفون: Xiaobin Yuan, Jae-Eun Park, Jin Wang, Enhai Zhao, David Ahlgren, Terence Hook, Jun Yuan, Victor Chan, Huiling Shang, Chu-Hsin Liang, Richard Lindsay, Sungjoon Park, Hyotae Choo
المصدر: IEEE Transactions on Device and Materials Reliability.
مصطلحات موضوعية: Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Electronic, Optical and Magnetic Materials
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4
المؤلفون: Hyotae Choo, Victor Chan, Sung-Joon Park, Jun Yuan, Jing Wang, Enhai Zhao, Huiling Shang, Jae-Eun Park, Terence B. Hook, Xiaobin Yuan, David C. Ahlgren, Chu-Hsin Liang, R. Lindsay
المصدر: 2007 IEEE International Integrated Reliability Workshop Final Report.
مصطلحات موضوعية: Materials science, CMOS, business.industry, Node (physics), MOSFET, Doping, Analytical chemistry, Optoelectronics, Electron, Current (fluid), business, Quantum tunnelling, Voltage
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d5d63e8775b9f35561fb0a60da2e8995
https://doi.org/10.1109/irws.2007.4469224 -
5دورية أكاديمية
المؤلفون: Xiaobin Yuan, Jae-Eun Park, Jing Wang, Enhai Zhao, Ahlgren, D.C., Hook, T., Jun Yuan, Chan, V., Huiling Shang, Chu-Hsin Liang, Lindsay, R., Sungjoon Park, Hyotae Choo
المصدر: IEEE Transactions on Device & Materials Reliability; Sep2008, Vol. 8 Issue 3, p501-508, 8p