المؤلفون: Yige Wang, Chuan Jia, Zewei Lyu, Minfang Han, Junwei Wu, Zaihong Sun, Fumitada Iguchi, Keiji Yashiro, Tatsuya Kawada

المصدر: Journal of Materiomics, Vol 8, Iss 2, Pp 347-357 (2022)

مصطلحات موضوعية: Solid oxide fuel cell, Gadolinium-doped ceria, Interlayer, Sr diffusion, Stability analysis, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S235284782100126X; https://doaj.org/toc/2352-8478

URL الوصول: https://doaj.org/article/cbdbf722018141c0b48e917abdbac418

المؤلفون: Xiaocheng Wang, Qingqing Jin, Lu Yang, Chuan Jia, Chunjiang Guan, Haining Wang, Hao Guo

المصدر: Frontiers in Marine Science, Vol 9 (2023)

مصطلحات موضوعية: Liaodong Bay, Nemopilema nomurai, jellyfish bloom, nuclear power cooling-water system, Aurelia coerulea, disaster-causing jellyfish, Science, General. Including nature conservation, geographical distribution, QH1-199.5

وصف الملف: electronic resource

Relation: https://www.frontiersin.org/articles/10.3389/fmars.2022.1098232/full; https://doaj.org/toc/2296-7745

URL الوصول: https://doaj.org/article/559147a23e9d4627a67c12b4595bbd69

المؤلفون: Xiaocheng WANG, Chuan JIA, Yi ZHANG, Qingqing JIN, Zizhu WANG, Yongjian LIU, Yan WANG, Kuishuang SHAO, Shouqiang WANG, Chunjiang GUAN, Hao GUO

المصدر: Haiyang Kaifa yu guanli, Vol 39, Iss 2, Pp 88-94 (2022)

مصطلحات موضوعية: yellow sea large marine ecosystem, climate change, nutrient, marine ecological disaster, marine monitoring, Oceanography, GC1-1581

وصف الملف: electronic resource

Relation: http://www.haiyangkaifayuguanli.com/hykfyglen/ch/reader/view_abstract.aspx?file_no=20220214&flag=1; https://doaj.org/toc/1005-9857

URL الوصول: https://doaj.org/article/1ae39ddac6ce4c14bcf01647e1aa8ec4

المؤلفون: Hsu, Hung-Hsi, Wen, Tai-Hao, Wu, Ping-Chun, Jhang, Chuan-Jia, You, De-Qi, Chen, Ping-Cheng, Chang, Meng-Fan

المصدر: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2023 IEEE 66th International Midwest Symposium on. :98-102 Aug, 2023

Relation: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)

المؤلفون: Dominik Stelzle, Peter Godfrey-Faussett, Chuan Jia, Obreniokibo Amiesimaka, Mary Mahy, Delivette Castor, Ioannis Hodges-Mameletzis, Lastone Chitembo, Rachel Baggaley, Shona Dalal

المصدر: PLoS Medicine, Vol 18, Iss 1, p e1003482 (2021)

مصطلحات موضوعية: Medicine

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1549-1277; https://doaj.org/toc/1549-1676

URL الوصول: https://doaj.org/article/91ae08ca64e149ac958252baee8c8ae7

المؤلفون: Huang, Wei-Hsing, Wen, Tai-Hao, Hung, Je-Min, Khwa, Win-San, Lo, Yun-Chen, Jhang, Chuan-Jia, Hsu, Huna-Hsi, Chin, Yu-Hsiana, Chen, Yu-Chiao, Lo, Chuna-Chuan, Liu, Ren-Shuo, Tang, Kea-Tiong, Hsieh, Chih-Cheng, Chih, Yu-Der, Chang, Tsung-Yung, Chang, Meng-Fan

المصدر: 2023 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2023 IEEE International. :15-17 Feb, 2023

Relation: 2023 IEEE International Solid-State Circuits Conference (ISSCC)

المؤلفون: Khwa, Win-San, Chiu, Yen-Cheng, Jhang, Chuan-Jia, Huang, Sheng-Po, Lee, Chun-Ying, Wen, Tai-Hao, Chang, Fu-Chun, Yu, Shao-Ming, Lee, Tung-Yin, Chang, Meng-Fan

المصدر: 2022 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2022 IEEE International. 65:1-3 Feb, 2022

Relation: 2022 IEEE International Solid-State Circuits Conference (ISSCC)

المؤلفون: Liu, Fang, Lin, Yuan-yuan, Jiao, Chuan-jia, Xu, Zhao-hua, Xu, Dong-hua, Luan, Shi-fang

المصدر: In Polymer 20 August 2024 308

المؤلفون: Xue, Cheng-Xin, Hung, Je-Min, Kao, Hui-Yao, Huang, Yen-Hsiang, Huang, Sheng-Po, Chang, Fu-Chun, Chen, Peng, Liu, Ta-Wei, Jhang, Chuan-Jia, Su, Chin-I, Khwa, Win-San, Lo, Chung-Chuan, Liu, Ren-Shuo, Hsieh, Chih-Cheng, Tang, Kea-Tiong, Chih, Yu-Der, Chang, Tsung-Yung Jonathan, Chang, Meng-Fan

المصدر: 2021 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2021 IEEE International. 64:245-247 Feb, 2021

Relation: 2021 IEEE International Solid-State Circuits Conference (ISSCC)

المؤلفون: Jhang, Chuan-Jia, Chen, Ping-Cheng, Chang, Meng-Fan

المصدر: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2021 International Symposium on. :1-2 Apr, 2021

Relation: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)