المؤلفون: Cheng, Ya-Chi, Tan, Pai-Yu, Wu, Cheng-Wen, Shieh, Ming-Der, Chuang, Chien-Hui, Liao, Gordon

المصدر: 2022 IEEE International Test Conference (ITC) ITC Test Conference (ITC), 2022 IEEE International. :601-608 Sep, 2022

Relation: 2022 IEEE International Test Conference (ITC)

المؤلفون: Lin, Yi-Tsung^{Aff1, Aff2, IDs10096023047333_cor1}, Chuang, Chien^{Aff1, Aff3}, Chou, Sheng-Hua, Juan, Chih-Han^{Aff1, Aff2}, Yang, Tsuey-Ching, Kreiswirth, Barry N., Chen, Liang^{Aff5, IDs10096023047333_cor7}

المصدر: European Journal of Clinical Microbiology & Infectious Diseases. 43(2):389-393

المؤلفون: Cheng, Ya-Chi, Tan, Pai-Yu, Wu, Cheng-Wen, Shieh, Ming-Der, Chuang, Chien-Hui, Liao, Gordon

المصدر: 2022 IEEE International Test Conference in Asia (ITC-Asia) ITC-ASIA Test Conference in Asia (ITC-Asia), 2022 IEEE International. :19-24 Aug, 2022

Relation: 2022 IEEE International Test Conference in Asia (ITC-Asia)

المؤلفون: Lin, Shian-Yu, Tan, Pai-Yu, Wu, Cheng-Wen, Shieh, Ming-Der, Chuang, Chien-Hui, Liao, Gordon

المصدر: 2022 IEEE International Test Conference in Asia (ITC-Asia) ITC-ASIA Test Conference in Asia (ITC-Asia), 2022 IEEE International. :25-30 Aug, 2022

Relation: 2022 IEEE International Test Conference in Asia (ITC-Asia)

المؤلفون: Chuang, Chien-Wen, Souma, Seigo, Moriya, Ayumi, Nakayama, Kosuke, Ikeda, Atsutoshi, Kawaguchi, Mayo, Obata, Keito, Saha, Shanta Ranjan, Takahashi, Hidemitsu, Kitagawa, Shunsaku, Ishida, Kenji, Tanaka, Kiyohisa, Kitamura, Miho, Horiba, Koji, Kumigashira, Hiroshi, Takahashi, Takashi, Yonezawa, Shingo, Paglione, Johnpierre, Maeno, Yoshiteru, Sato, Takafumi

المصدر: Phys. Rev. Materials 6, 104203 (2022)

مصطلحات موضوعية: Condensed Matter - Superconductivity, Condensed Matter - Mesoscale and Nanoscale Physics, Condensed Matter - Strongly Correlated Electrons

URL الوصول: http://arxiv.org/abs/2211.15083

المؤلفون: Kimball, Alexa B.^{Aff1, IDs13555023009655_cor1}, Delevry, Dimittri, Yang, Min, Chuang, Chien-Chia, Wang, Zhixiao, Bégo-Le-Bagousse, Gaëlle, Martins, Bruno, Wu, Eric, Shumel, Brad, Wang, Jessie, Sierka, Debra, Chao, Jingdong, Strober, Bruce^{Aff6, Aff7}

المصدر: Dermatology and Therapy: Research, treatment and aesthetic interventions in dermatology. 13(9):2107-2120

المؤلفون: Chuang, Chien^{Aff1, Aff2}, Lee, Kuei-Chuan^{Aff2, Aff3}, Wang, Yen-Po^{Aff2, Aff3, Aff4}, Lee, Pei-Chang^{Aff2, Aff3}, Chang, Tien-En^{Aff2, Aff3, Aff4}, Huang, Yi-Hsiang^{Aff2, Aff3}, Lin, Yi-Tsung^{Aff1, Aff5, IDs10096023046443_cor7}, Hou, Ming-Chih^{Aff2, Aff3, IDs10096023046443_cor8}

المصدر: European Journal of Clinical Microbiology & Infectious Diseases. 42(9):1103-1113

المؤلفون: Siegfried, Elaine C.^{Aff1, Aff2}, Cork, Michael J.^{Aff3, Aff4}, Katoh, Norito, Zhang, Haixin, Chuang, Chien-Chia, Thomas, Ryan B., Rossi, Ana B., Cyr, Sonya L., Zhang, Annie^{Aff7, IDs40257023007917_cor9}

المصدر: American Journal of Clinical Dermatology. 24(5):787-798

المؤلفون: Chuang, Chien-Hui, Hou, Kuan-Wei, Wu, Cheng-Wen, Lee, Mincent, Tsai, Chia-Heng, Chen, Hao, Wang, Min-Jer

المصدر: 2020 IEEE International Test Conference (ITC) Test Conference (ITC), 2020 IEEE International. :1-9 Nov, 2020

Relation: 2020 IEEE International Test Conference (ITC)

المؤلفون: Lee, Shih-Ping, Tseng, Tzu-Hsuan, Chuang, Chih-Hao, Chuang, Chien-Ying, Cheng, Cheng-Hung, Tung, Hsin-Ying, Huang, Pin-Chieh, Chou, Chung-Tien

المصدر: 2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM),2019 Joint International Symposium on. :1-4 Sep, 2019

Relation: 2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)