المؤلفون: Bury, E., Chasin, A., Kaczer, B., Chuang, K.-H., Franco, J., Simicic, M., Weckx, P., Linten, D.

المصدر: 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Solid-State and Integrated Circuit Technology (ICSICT), 2018 14th IEEE International Conference on. :1-4 Oct, 2018

Relation: 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

المؤلفون: Verbauwhede, I., Chuang, K.-H.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :13.4.1-13.4.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Hartono, S., Thng, C. H., Ng, Q. S., Yong, C. X., Yang, C.-T., Shi, W., Chuang, K. H., Koh, T. S.

المصدر: 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE. :2788-2791 Aug, 2011

Relation: 2011 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

المؤلفون: Bury, E., Chasin, A., Kaczer, B., Chuang, K.-H., Franco, J., Simicic, M., Weckx, P., Linten, D.

المصدر: 2018 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2018 IEEE International. :2A.3-1-2A.3-6 Mar, 2018

Relation: 2018 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Chuang, K.-H., Bury, E., Degraeve, R., Kaczer, B., Kallstenius, T., Groeseneken, G., Linten, D., Verbauwhede, I.

المصدر: 2018 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2018 IEEE International. :P-CR.2-1-P-CR.2-5 Mar, 2018

Relation: 2018 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Yuan, F., Chuang, K.-H., Liu, J.

المصدر: IEEE Transactions on Biomedical Engineering IEEE Trans. Biomed. Eng. Biomedical Engineering, IEEE Transactions on. 60(6):1589-1598 Jun, 2013

المؤلفون: Chuang, K.-H., Bury, E., Degraeve, R., Kaczer, B., Groeseneken, G., Verbauwhede, I., Linten, D.

المصدر: 2017 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS),2017 IEEE International. :4C-1.1-4C-1.7 Apr, 2017

Relation: 2017 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Chou, N., Wu, J., Bai Bingren, J., Qiu, A., Chuang, K.-H.

المصدر: IEEE Transactions on Image Processing IEEE Trans. on Image Process. Image Processing, IEEE Transactions on. 20(9):2554-2564 Sep, 2011

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