يعرض 1 - 10 نتائج من 61 نتيجة بحث عن '"Chui, King-Jien"', وقت الاستعلام: 1.58s تنقيح النتائج
  1. 1
    مؤتمر
    Design and Fabrication of 2.5D Cryogenic Interposer With Integrated Superconducting TSVs and Resonators

    المؤلفون: Li, HongYu, Chui, King-Jien, Kiat Goh, Simon Chun, Perdana Budoyo, Rangga, Long, Nguyen Hoang, Chyn Ng, Yong, Lau, Daniel, Jaafar, B. N., Paul Tan, Yuanzheng, Dumke, Rainer

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :458-463 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Electrical Characterization and Reliability Studies of Nano-TSV

    المؤلفون: Tseng, Ya-Ching, Chui, King-Jien, Goh, Simon Chun Kiat, Lau, Daniel, Li, Hongyu, Anh, Tran Van Nhat, Yu, Haitao, Tew, Chin Khang, Chen, Gim Guan, Varghese, Binni, Ming, Calvin Chua Hung

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1581-1586 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing

    المؤلفون: Kiat Goh, Simon Chun, Hemanth Kumar, Cheemalamarri, Hu, Liangxing, Shervonne, Woon, Jaafar, Norhanani, Khoon Sherry, Yap Lee, Huang, Ding, Lau, Chit Siong, Kumar Karuppannan, Senthil, Li, Hongyu, Tan, Chuan Seng, Chui, King-Jien

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :404-408 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  4. 4
    مؤتمر
    Demonstration and Challenges of Through Si Interposer (TSI) with 5-layer Frontside Cu Metal and 2-layer Backside Cu RDL

    المؤلفون: Tseng, Ya-Ching, Chui, King-Jien

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1067-1070 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  5. 5
    مؤتمر
    Development of Crossflow Manifold for Two-Phase Liquid Cooling of 3D ICs via 3D Printing

    المؤلفون: Feng, Huicheng, Tang, Gongyue, Zhang, Xiaowu, Lau, Boon Long, Jong, Ming Chinq, Au, Keng Yuen Jason, Ong, Jun Wei Javier, Chui, King Jien, Li, Jun, Li, Hongying, Le, Duc Vinh, Lou, Jing

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1012-1016 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  6. 6
    مؤتمر
    Indium-based Flip-chip Interconnect for Cryogenic Packaging

    المؤلفون: Jaafar, Norhanani Binte, Hongyu, Li, Choong, Chong Ser, Yong Chyn, Ng, Huang, Ding, Lau, Chit Siong, Goh, Kuan Eng Johnson, Chui, King-Jien

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :970-973 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  7. 7
    مؤتمر
    Investigation of SnAg Superconductivity as Solder Material for Cryogenic Packaging

    المؤلفون: Ng, Yong Chyn, Li, Hongyu, Jaafar, Norhanani Binte, Cheow Siong Lee, Rainer, Huang, Ding, Lau, Chit Siong, Eng Johnson Goh, Kuan, Chui, King-Jien

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :227-230 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  8. 8
    مؤتمر
    Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration

    المؤلفون: Wang, Xiangyu, Rotaru, Mihai Dragos, Haitao, Yu, Jonq, Mingchinq, Chong, Chai Tai, Chui, King-Jien

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :116-119 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  9. 9
    مؤتمر
    Evaluation of Low Temperature Inorganic Dielectric Materials for Hybrid Bonding Applications

    المؤلفون: Kumar, Mishra Dileep, Nagendra Sekhar, Vasarla, Choong, Chong Ser, Chandra Rao, B.S.S., Chui, King-Jien, Rao, Vempati Srinivasa

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :354-358 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  10. 10
    مؤتمر
    Demonstration of a CMOS-Compatible Superconducting Cryogenic Interposer for Advanced Quantum Processors

    المؤلفون: Chui, King-Jien, Li, Hongyu, Ng, Yong Chyn, Lau, Chit Siong, Goh, K. E. J., Huang, D., Tseng, Ya-Ching, Chen, J. K., Yu, H., Jaafar, B. N., Lin, H., Varghese, B.

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :617-622 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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