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1مؤتمر
المؤلفون: Chun Keang Ooi, Chia-Pin Chiu, Joo Leong Chan, Martin Tay Tiong We
المصدر: 2006 8th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2006. EPTC '06. 8th. :800-805 Dec, 2006
Relation: 2006 8th Electronics Packaging Technology Conference
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2
المؤلفون: Muhammad Afiq Azmi, Mohd Zulkifly Abdullah, Raa Khimi Shuib, Zulkifli Mohamad Ariff, Wei Keat Loh, Renn Chan Ooi, Chun Keang Ooi, Muhammad Khalil Abdullah
المصدر: Polymer Bulletin.
مصطلحات موضوعية: Polymers and Plastics, Materials Chemistry, General Chemistry, Condensed Matter Physics
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3
المؤلفون: Renn Chan Ooi, Muhammad Khalil Abdullah, M. H. H. Ishak, Mohd Zulkifly Abdullah, Abdul Aziz, Chun Keang Ooi, Wei Keat Loh
المصدر: Applied Mechanics and Materials. 786:361-366
مصطلحات موضوعية: Engineering, Finite volume method, business.industry, Mechanical engineering, General Medicine, Chip, Die (integrated circuit), Encapsulation (networking), Software, Fluent, Electronic engineering, Volume of fluid method, business, Flip chip
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4
المؤلفون: Wei Keat Loh, Renn Chan Ooi, Mohd Zulkifly Abdullah, Dadan Ramdan, Wei Chiat Leong, Chun Keang Ooi, C. Y. Khor
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:1786-1795
مصطلحات موضوعية: Materials science, business.product_category, Gambit, Solid modeling, medicine.disease_cause, GeneralLiterature_MISCELLANEOUS, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Ball grid array, Mold, Fluid–structure interaction, Volume of fluid method, medicine, Fluent, Electronic engineering, Die (manufacturing), Electrical and Electronic Engineering, Composite material, business
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5
المؤلفون: Renn Chan Ooi, Wei Keat Loh, M. A. Mujeebu, Z. M. Abdullah, Chun Keang Ooi, Dadan Ramdan
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:593-603
مصطلحات موضوعية: Materials science, business.industry, Mechanical engineering, Molding (process), Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Shear rate, Rheology, Ball grid array, Volume of fluid method, Fluid dynamics, Fluent, Microelectronics, Electrical and Electronic Engineering, Composite material, business
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6
المؤلفون: David Chau, L. Bharatham, Chia-Pin Chiu, Chun Keang Ooi, A. Gupta
المصدر: 2006 International Conference on Electronic Materials and Packaging.
مصطلحات موضوعية: Thermal design power, Engineering, Heat flux, Chipset, business.industry, Thermal resistance, Electronic engineering, Mechanical engineering, Computational fluid dynamics, business, Temperature measurement, Flip chip, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::27c3648b3b6196424cdf27a08869a1f8
https://doi.org/10.1109/emap.2006.4430576 -
7مؤتمر
المؤلفون: Chun Keang Ooi, Bharatham, L., Chia-Pin Chiu, Chau, D., Gupta, A.
المصدر: 2006 International Conference on Electronic Materials & Packaging; 2006, p1-6, 6p