المؤلفون: Chun Keang Ooi, Chia-Pin Chiu, Joo Leong Chan, Martin Tay Tiong We

المصدر: 2006 8th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2006. EPTC '06. 8th. :800-805 Dec, 2006

Relation: 2006 8th Electronics Packaging Technology Conference

المؤلفون: Muhammad Afiq Azmi, Mohd Zulkifly Abdullah, Raa Khimi Shuib, Zulkifli Mohamad Ariff, Wei Keat Loh, Renn Chan Ooi, Chun Keang Ooi, Muhammad Khalil Abdullah

المصدر: Polymer Bulletin.

مصطلحات موضوعية: Polymers and Plastics, Materials Chemistry, General Chemistry, Condensed Matter Physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::61fdebeac7ca8afcc5dbcb63561394a9
https://doi.org/10.1007/s00289-023-04805-6

المؤلفون: Renn Chan Ooi, Muhammad Khalil Abdullah, M. H. H. Ishak, Mohd Zulkifly Abdullah, Abdul Aziz, Chun Keang Ooi, Wei Keat Loh

المصدر: Applied Mechanics and Materials. 786:361-366

مصطلحات موضوعية: Engineering, Finite volume method, business.industry, Mechanical engineering, General Medicine, Chip, Die (integrated circuit), Encapsulation (networking), Software, Fluent, Electronic engineering, Volume of fluid method, business, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a1b6a606992ca77e2a0a4acf68008cce
https://doi.org/10.4028/www.scientific.net/amm.786.361

المؤلفون: Wei Keat Loh, Renn Chan Ooi, Mohd Zulkifly Abdullah, Dadan Ramdan, Wei Chiat Leong, Chun Keang Ooi, C. Y. Khor

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:1786-1795

مصطلحات موضوعية: Materials science, business.product_category, Gambit, Solid modeling, medicine.disease_cause, GeneralLiterature_MISCELLANEOUS, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Ball grid array, Mold, Fluid–structure interaction, Volume of fluid method, medicine, Fluent, Electronic engineering, Die (manufacturing), Electrical and Electronic Engineering, Composite material, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::10d17bd858648673c628d607a0de3bc4
https://doi.org/10.1109/tcpmt.2012.2215860

المؤلفون: Renn Chan Ooi, Wei Keat Loh, M. A. Mujeebu, Z. M. Abdullah, Chun Keang Ooi, Dadan Ramdan

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:593-603

مصطلحات موضوعية: Materials science, business.industry, Mechanical engineering, Molding (process), Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Shear rate, Rheology, Ball grid array, Volume of fluid method, Fluid dynamics, Fluent, Microelectronics, Electrical and Electronic Engineering, Composite material, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0d038c9fb0bc77542d9bb1166d8a2741
https://doi.org/10.1109/tcpmt.2011.2171513

المؤلفون: David Chau, L. Bharatham, Chia-Pin Chiu, Chun Keang Ooi, A. Gupta

المصدر: 2006 International Conference on Electronic Materials and Packaging.

مصطلحات موضوعية: Thermal design power, Engineering, Heat flux, Chipset, business.industry, Thermal resistance, Electronic engineering, Mechanical engineering, Computational fluid dynamics, business, Temperature measurement, Flip chip, Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::27c3648b3b6196424cdf27a08869a1f8
https://doi.org/10.1109/emap.2006.4430576

المؤلفون: Chun Keang Ooi, Bharatham, L., Chia-Pin Chiu, Chau, D., Gupta, A.

المصدر: 2006 International Conference on Electronic Materials & Packaging; 2006, p1-6, 6p