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المؤلفون: Chung-Shi Liu, Chen Chien-Hsun, Wu Jiun Yi, Douglas Yu, C. H. Lee
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Wafer fabrication, Interconnection, Reliability (semiconductor), Computer science, Hardware_INTEGRATEDCIRCUITS, Impedance matching, SerDes, Electronic engineering, Wafer, Hardware_PERFORMANCEANDRELIABILITY, Substrate (printing), Routing (electronic design automation)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9f1b7f6b0776547ef500c235968408fc
https://doi.org/10.1109/ectc32696.2021.00016 -
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المؤلفون: Terry Ku, Tsung-Shu Lin, Jeng-Shien Hsieh, Chun Shu-Rong, Douglas Yu, Hao-Yi Tsai, Chung-Shi Liu, Tin-Hao Kuo, Chuei-Tang Wang
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: business.industry, Computer science, 0211 other engineering and technologies, Electrical engineering, 021107 urban & regional planning, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Supercomputer, 03 medical and health sciences, 0302 clinical medicine, Reliability (semiconductor), Scalability, Hardware_INTEGRATEDCIRCUITS, System integration, Wafer, 030212 general & internal medicine, Latency (engineering), business, Electrical impedance, Electrical efficiency
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4e06ab1b1390cb86fd4f3d2596453df0
https://doi.org/10.1109/ectc32862.2020.00013 -
3
المؤلفون: Wu Kai-Chiang, Chung-Hao Tsai, Tang Tzu-Chun, Doug C. H. Yu, Chung-Shi Liu, Che-Wei Hsu, Chuei-Tang Wang, Pu Han-Ping, Chia-Chia Lin, Lu Chun-Lin
المصدر: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS).
مصطلحات موضوعية: Inductance, Coupling, Materials science, business.industry, Q factor, Optoelectronics, Solenoid, Redistribution layer, Molding (process), business, Inductor, Rf system
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1c5ab65c83e3becf688654525e1270b8
https://doi.org/10.1109/edaps47854.2019.9011648 -
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المؤلفون: Chien-Fu Tseng, Chung-Shi Liu, Chi-Hsi Wu, Douglas Yu
المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, Mobile computing, Fan-out, 02 engineering and technology, 021001 nanoscience & nanotechnology, Chip, 01 natural sciences, System requirements, Form factor (design), Reliability (semiconductor), Embedded system, 0103 physical sciences, System integration, 0210 nano-technology, business, Mobile device
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::36980a93c432694df1cad5c2cc9e3607
https://doi.org/10.1109/ectc.2016.65 -
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المؤلفون: Max K. C. Wu, Douglas Yu, Chung Shi Liu
المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, Structural engineering, Fan-in, Chip, Inductor, 01 natural sciences, Automotive engineering, Chip-scale package, Soldering, 0103 physical sciences, Ball (bearing), Wafer, business, Weibull distribution
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::349651742e3763815d7ea8f40073a813
https://doi.org/10.1109/ectc.2016.87 -
6Ultra Fine Pitch / Low Cost FCCSP Package and Chip Package Interaction (CPI) for Advanced CMOS Nodes
المؤلفون: Yen-Liang Lin, Douglas Yu, Chung-Shi Liu
المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Thermal copper pillar bump, Materials science, business.industry, Copper interconnect, Stacking, 02 engineering and technology, Thermocompression bonding, 021001 nanoscience & nanotechnology, Chip, 01 natural sciences, CMOS, 0103 physical sciences, Electronic engineering, Optoelectronics, Wafer, 0210 nano-technology, business, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b88c4fcbeac25a29377e6a77aadf3645
https://doi.org/10.1109/ectc.2016.125 -
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المؤلفون: Chung-Shi Liu, En-Hsiang Yeh, Monsen Liu, Jeng-Shien Hsieh, Ching-Wen Hsiao, Chuei-Tang Wang, Chung-Hao Tsai, Doug C. H. Yu, Chen-Shien Chen, Hsu-Hsien Chen, Mirng-Ji Lii
المصدر: 2013 IEEE International Electron Devices Meeting.
مصطلحات موضوعية: Engineering, Coaxial antenna, business.industry, Antenna measurement, Electrical engineering, Antenna factor, law.invention, Antenna array, Microstrip antenna, law, Dipole antenna, Antenna (radio), business, Monopole antenna
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f24c7397624ab8f65cd58e6369ec3cc9
https://doi.org/10.1109/iedm.2013.6724687 -
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المؤلفون: Jone F. Chen, Shin-Fu Chen, Kuen-Shiuan Tian, Tsung-Yi Huang, K. Wu, J.R. Lee, Chung-Shi Liu
المصدر: Electronics Letters. 44:991
مصطلحات موضوعية: LDMOS, Materials science, business.industry, Circuit design, Transistor, Electrical engineering, equipment and supplies, law.invention, law, MOSFET, Optoelectronics, Degradation (geology), Electrical and Electronic Engineering, Electric current, business, Extrinsic semiconductor, Hot-carrier injection