يعرض 1 - 10 نتائج من 70 نتيجة بحث عن '"Chunho Kim"', وقت الاستعلام: 0.98s تنقيح النتائج
  1. 1
    مؤتمر
    Wetting Dynamics of Eutectic and Lead-Free Solders with Various Reflow Conditions and Surface Finish Metallizations

    المؤلفون: Suk Chae Kang, Chunho Kim, Muncy, J., Schmidt, M., Sangil Lee, Baldwin, D.

    المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :832-842 2005

    Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference

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  2. 2
    مؤتمر
    Experimental wetting dynamics study of eutectic and lead-free solders varying flux, temperature and surface finish metallization

    المؤلفون: Suk Chae Kang, Chunho Kim, Muncy, J., Schmidt, M., Baldwin, D.

    المصدر: IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International. :56-63 2004

    Relation: IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium

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  3. 3
    مؤتمر
    No-flow underfill process modeling and analysis for low cost, high throughput flip chip assembly

    المؤلفون: Chunho Kim, Baldwin, D.F.

    المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1402-1410 2002

    Relation: Proceedings of 52nd Electronic Components and Technology Conference

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  4. 4
    مؤتمر
    Design guidelines to implement Six Sigma in assembly process yield of area array solder interconnect packages

    المؤلفون: Chunho Kim, Baldwin, D.F.

    المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1560-1568 2002

    Relation: Proceedings of 52nd Electronic Components and Technology Conference

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  5. 5
    مؤتمر
    Effects of variations in design and process parameters on assembly process yield of area array solder interconnect packages

    المؤلفون: Chunho Kim, Baldwin, D.F.

    المصدر: 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) Advanced packaging materials symposium Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on. :278-284 2002

    Relation: 2002 8th International Advanced Packaging Materials Symposium

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  6. 6
    مؤتمر
    No-flow underfill process optimization for high yield and reliability in flip chip assembly

    المؤلفون: Chunho Kim, Lazarakis, T., Baldwin, D.F.

    المصدر: 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) Advanced packaging materials symposium Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on. :271-277 2002

    Relation: 2002 8th International Advanced Packaging Materials Symposium

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  7. 7
    دورية أكاديمية
    A theoretical yield model for assembly process of area array solder interconnect packages with experimental verification

    المؤلفون: Chunho Kim, Baldwin, D.F.

    المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 28(4):344-354 Oct, 2005

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  8. 8
    دورية أكاديمية
    Experimental wetting dynamics study of eutectic and lead-free solders with various fluxes, isothermal conditions, and bond pad metallizations

    المؤلفون: Suk Chae Kang, Chunho Kim, Muncy, J., Baldwin, D.F.

    المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 28(3):465-474 Aug, 2005

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  9. 9
    دورية أكاديمية
    High density, high aspect ratio through-wafer electrical interconnect vias for MEMS packaging

    المؤلفون: Seong Joon Ok, Chunho Kim, Baldwin, D.F.

    المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 26(3):302-309 Aug, 2003

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  10. 10
    دورية أكاديمية
    No-flow underfill process modeling and analysis for low cost, high throughput flip chip assembly

    المؤلفون: Chunho Kim, Baldwin, D.F.

    المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 26(2):156-165 Apr, 2003

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