-
1
المؤلفون: Kuei Hsiao Kuo, Jason Lee, Cindy Mao, Rick Lee, Katch Wang, Feng Lung Chien
المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Substrate (building), Materials science, Organic solderability preservative, Soldering, Metallurgy, Pillar, Fine pitch, Electromigration, Current density, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::98b430efbb8f7bec3b04e82841e7db91
https://doi.org/10.1109/ectc.2015.7159657 -
2
المؤلفون: Rick Lee, Cindy Mao, Jason Lee, Kuei Hsiao Kuo Frank, John H. Lau, Feng Lung Chien
المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Thermal copper pillar bump, Materials science, Organic solderability preservative, Soldering, Metallurgy, Intermetallic, Thermocompression bonding, Current density, Electromigration, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::41f920dff6958e17973d4ef459b3f1c3
https://doi.org/10.1109/ectc.2014.6897267