يعرض 1 - 10 نتائج من 13 نتيجة بحث عن '"Cioccio, Lea Di"', وقت الاستعلام: 0.87s تنقيح النتائج
  1. 1
    مؤتمر
    Comparative life cycle assessment of hybrid bonding and copper pillar die-to-wafer 3D integrations for sub-THz applications

    المؤلفون: Roulleau, Lea, Vauche, Laura, Valorge, Olivier, Dubarry, Christophe, Cioccio, Lea Di

    المصدر: 2023 18th European Microwave Integrated Circuits Conference (EuMIC) Microwave Integrated Circuits Conference (EuMIC), 2023 18th European. :390-393 Sep, 2023

    Relation: 2023 18th European Microwave Integrated Circuits Conference (EuMIC)

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  2. 2
    دورية أكاديمية
    Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration

    المؤلفون: Gueguen, Pierric, Ventosa, Caroline, Cioccio, Léa Di, Moriceau, Hubert, Grossi, François, Rivoire, Maurice, Leduc, Patrick, Clavelier, Laurent

    المصدر: In Microelectronic Engineering 2010 87(3):477-484

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  3. 3
    دورية أكاديمية
    Heat and mass transfer modeling for a better knowledge of the large-area growth of homoepitaxial SiC by CVD

    المؤلفون: Pons, Michel, Mezière, Jerome, Dedulle, Jean Marc, Kuan, Stephane Wan Tang, Blanquet, Elisabeth, Bernard, Claude, Ferret, Pierre, Cioccio, Lea Di, Billon, Thierry, Madar, Roland

    المصدر: MRS Online Proceedings Library. 640(1)

    Find this article in full text from Springer Verlag.
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  4. 4
    دورية
    Modeling and Integration Phenomena of metal-metal direct bonding technology

    المؤلفون: Cioccio, Lea Di, Baudin, Floriane, Gergaud, Patrice, Delaye, Vincent, Jouneau, Henri, Rieutord, Francois, Signamarcheix, Thomas

    المصدر: ECS Transactions; August 2014, Vol. 64 Issue: 5 p339-355, 17p

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  5. 5
    دورية
    (Invited) Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration

    المؤلفون: Cioccio, Lea Di, Radu, Ionut, Gaudin, Gweltaz, Lacave, Thomas, Baudin, Floriane, Sadaka, Mariam, Signamarcheix, Thomas

    المصدر: ECS Transactions; August 2013, Vol. 58 Issue: 9 p17-28, 12p

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  6. 6
    دورية
    Evaluation of Titanium Direct Bonding Mechanism

    المؤلفون: Baudin, Floriane, Delaye, Vincent, Guedj, Cyril, Chevalier, Nicolas, Mariolle, Denis, Imbert, Bruno, Fabbri, Marc, Cioccio, Lea Di, Brechet, Yves

    المصدر: ECS Transactions; March 2013, Vol. 50 Issue: 7 p125-132, 8p

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  7. 7
    دورية
    Wafer Level 3D Stacking Using Smart Cut and Metal-Metal Direct Bonding Technology

    المؤلفون: Cioccio, Lea Di, Radu, Ionut, Baudin, Floriane, Mounier, Angelique, Lacave, Thomas, Delaye, Vincent, Imbert, Bruno, Chevalier, Nicolas, Denis, Mariolle, Gaudin, Gweltaz, Mazen, Frederic, Thieffry, Stephane, Signamarcheix, Thomas

    المصدر: ECS Transactions; March 2013, Vol. 50 Issue: 7 p169-175, 7p

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  8. 8
    دورية
    (Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

    المؤلفون: Cioccio, Lea Di, Landru, Didier, Rieutord, Francois, Crecy, De, Radu, Ionut, and, Chapelon, Clavelier, Laurent

    المصدر: ECS Transactions; October 2010, Vol. 33 Issue: 4 p3-16, 14p

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  9. 9
    دورية
    Copper Direct-Bonding Characterization and Its Interests for 3D Integration

    المؤلفون: Gueguen, Pierric, Cioccio, Lea Di, Gergaud, Patrice, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Marie, Anne, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent

    المصدر: Journal of the Electrochemical Society; October 2009, Vol. 156 Issue: 10 pH772-H776, 5p

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  10. 10
    دورية
    Copper Direct Bonding Characterization and its Interests for 3D Integration Circuits

    المؤلفون: Gueguen, Pierric, Cioccio, Lea Di, Gergaud, Patrice, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Marie, Anne, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent

    المصدر: ECS Transactions; October 2008, Vol. 16 Issue: 8 p31-37, 7p

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