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1مؤتمر
المؤلفون: May, D., Wunderle, B., Cirulis, I., Braun, S., Zschenderlein, U., Heilmann, J., Pantou, R., Schacht, R., Rzepka, R., Ras, M. Abo, Kurth, S., Kuhn, H.
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-8 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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2مؤتمر
المؤلفون: Cirulis, I., Zschenderlein, U., Braun, S., Radestock, M., Pantou, R., Vogel, K., Selbmann, F., Kurth, S., Wunderle, B., Kuhn, H.
المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023
Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
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3دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
4مؤتمر
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
5دورية
المؤلفون: Lapcinskis, L, Cirulis, I, Lesnicenoks, P, Abele, A, Sutka, A, Knite, M
المصدر: IOP Conference Series: Materials Science and Engineering; April 2019, Vol. 500 Issue: 1 p012018-012018, 1p
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