المؤلفون: Dickson, T.O., Deniz, Z.T., Cochet, M., Beukema, T.J., Kossel, M., Morf, T., Choi, Y., Francese, P.A., Brandli, M., Baks, C.W., Proesel, J.E., Bulzacchelli, J.F., Beakes, M.P., Yoo, B., Ahn, H., Lim, D., Kang, G., Park, S., Meghelli, M., Rhew, H.G., Friedman, D.J., Choi, M., Soyuer, M., Shin, J.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 58(4):1074-1086 Apr, 2023

المؤلفون: Ruiz, E. R. Carreón, Lee, J., Damián, J. I. Márquez, Strobl, M., Burca, G., Woracek, R., Cochet, M., Ebert, M. -O., Höltschi, L., Kadletz, P. M., Tremsin, A. S., Winter, E., Zlobinski, M., Gubler, L., Boillat, P.

مصطلحات موضوعية: Condensed Matter - Materials Science, Physics - Chemical Physics

URL الوصول: http://arxiv.org/abs/2207.08517

المؤلفون: Martínez, M. T., Callejas, M. A., Benito, A. M., Cochet, M., Seeger, T., Ansón, A., Schreiber, J., Gordon, C., Marhic, C., Chauvet, O., Maser, W. K.

المصدر: Boletín de la Sociedad Española de Cerámica y Vidrio, Vol 43, Iss 2, Pp 524-526 (2004)

مصطلحات موضوعية: Nanotubes, Raman Spectroscopy, TEM, Nanotubos, espectroscopía Raman, microscopía de transmisión electrónica, Clay industries. Ceramics. Glass, TP785-869

وصف الملف: electronic resource

Relation: http://ceramicayvidrio.revistas.csic.es/index.php/ceramicayvidrio/article/view/585/607; https://doaj.org/toc/0366-3175

URL الوصول: https://doaj.org/article/0aa54b988ab24ae1a98961e46f6a7f0e

المؤلفون: Chandramoorthy, N., Swaminathan, K., Cochet, M., Paidimarri, A., Eldridge, S., Joshi, R.V., Ziegler, M.M., Buyuktosunoglu, A., Bose, P.

المصدر: 2019 IEEE International Symposium on High Performance Computer Architecture (HPCA) HPCA High Performance Computer Architecture (HPCA), 2019 IEEE International Symposium on. :147-158 Feb, 2019

Relation: 2019 IEEE International Symposium on High Performance Computer Architecture (HPCA)

المؤلفون: Lallement, G., Abouzeid, F., Cochet, M., Daveau, J.-M., Roche, P., Autran, J.-L.

المصدر: ESSCIRC 2017 - 43rd IEEE European Solid State Circuits Conference. :153-162 Sep, 2017

Relation: ESSCIRC 2017 - 43rd IEEE European Solid State Circuits Conference (ESSCIRC)

المؤلفون: Lallement, G., Abouzeid, F., Cochet, M., Daveau, J., Roche, P., Autran, J.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 53(7):2088-2100 Jul, 2018

المؤلفون: Keller, B., Cochet, M., Zimmer, B., Kwak, J., Puggelli, A., Lee, Y., Blagojevic, M., Bailey, S., Chiu, P., Dabbelt, P., Schmidt, C., Alon, E., Asanovic, K., Nikolic, B.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 52(7):1863-1875 Jul, 2017

المؤلفون: Bottausci, F., Baleras, F., Pudda, C., Cochet, M., Chabrol, C., Sauter-Starace, F., Oziat, J., Rovetta, M., Icard, B., Guiraud, D., Divoux, J.L., Malbert, C.H., Henry, C., Maubert, S.

المصدر: 2015 7th International IEEE/EMBS Conference on Neural Engineering (NER) Neural Engineering (NER), 2015 7th International IEEE/EMBS Conference on. :466-469 Apr, 2015

Relation: 2015 7th International IEEE/EMBS Conference on Neural Engineering (NER)

المؤلفون: Cazorla, P.-H., Fuchs, O., Cochet, M., Maubert, S., Le Rhun, G., Fouillet, Y., Defay, E.

المصدر: 2014 IEEE International Ultrasonics Symposium Ultrasonics Symposium (IUS), 2014 IEEE International. :491-494 Sep, 2014

Relation: 2014 IEEE International Ultrasonics Symposium (IUS)

المؤلفون: Agache, V., Blanco-Gomez, G., Cochet, M., Caillat, P.

المصدر: 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on. :157-160 Jan, 2011

Relation: 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS)