يعرض 1 - 10 نتائج من 128,344 نتيجة بحث عن '"Compatibility"', وقت الاستعلام: 1.40s تنقيح النتائج
  1. 1
    مؤتمر
    Complex Analysis of IEMI in Grounding Circuits of Critical Equipment: Preliminary Results

    المؤلفون: Gazizov, Talgat R., Nguyen, Van D., Hasan, Adnan A.

    المصدر: 2024 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM) Industrial Engineering, Applications and Manufacturing (ICIEAM), 2024 International Conference on. :413-417 May, 2024

    Relation: 2024 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM)

    أضف إلى المفضلة
  2. 2
    دورية أكاديمية
    An Analysis of Electromagnetic Signatures From Triangularly Modulated Spread Spectrum Clocking Signals

    المؤلفون: Lee, E., Choi, D., Nam, T., Choi, W., Yook, J.

    المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 66(3):749-760 Jun, 2024

    Full Text Finder
    أضف إلى المفضلة
  3. 3
    دورية أكاديمية
    Early-Stage HF-EMC Simulation Analyses of Common-Mode Current in SiC-Based Motor Drive System for Modern Aircraft Applications

    المؤلفون: Almeida, G., Cousineau, M., Rouger, N., Serpaud, S., Santos, V.D., Cougo, B., Guedon, D., Crepel, O., Perraud, R.

    المصدر: IEEE Transactions on Transportation Electrification IEEE Trans. Transp. Electrific. Transportation Electrification, IEEE Transactions on. 10(2):4393-4406 Jun, 2024

    Full Text Finder
    أضف إلى المفضلة
  4. 4
    مؤتمر
    Enhancing Organ Donation: Web-based System for Promoting Awareness with Machine Learning for Optimized Matching

    المؤلفون: Patil, Aditi, Mahamuni, Chaitanya V, Patil, Kaustubh, Kunjumon, Roy, Nadar, Kingston

    المصدر: 2024 3rd International Conference on Applied Artificial Intelligence and Computing (ICAAIC) Applied Artificial Intelligence and Computing (ICAAIC), 2024 3rd International Conference on. :451-458 Jun, 2024

    Relation: 2024 3rd International Conference on Applied Artificial Intelligence and Computing (ICAAIC)

    أضف إلى المفضلة
  5. 5
    مؤتمر
    Study of Stress and Warpage Estimate of FOWLP under Hygro-Thermal Coupling Loading Condition

    المؤلفون: Huang, Yu-Wei, Kumar Yadav, Ruchi Ashok, Lin, Hong-Yu, Lee, Chien-Han, Lee, Chang-Chun

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1599-1602 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  6. 6
    مؤتمر
    Novel Molded FCBGA Package Platform for Highly Reliable Automotive Applications

    المؤلفون: InRak.Kim, Nari.Kim, Gayoung.Shin, Youngdo.Kweon, Nathan.Whitchurch

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :949-954 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  7. 7
    مؤتمر
    Transitioning from Warpage "Control" to Warpage "Design": A Paradigm Shift

    المؤلفون: Phansalkar, Sukrut Prashant, Han, Bongtae, Lee, Gun

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1187-1192 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  8. 8
    مؤتمر
    Enhancing Cu Wire-Bonding Reliability by a Cu-Selective Passivation Coating

    المؤلفون: Kumaravel, Dinesh Kumar, Durai, Kevin Antony Jesu, Nair, Shyam M, Nair, Shinoj S, Yu, Hailey Huijun, Alptekin, John, Chyan, Oliver M.R., Mathew, Varughese

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1206-1212 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  9. 9
    مؤتمر
    New Double Sided Molded Package Platform Development with Open Cavity Mold on One Side and Exposed Die Mold on the Other Side

    المؤلفون: Choi, MiKyeong, Tsai, Julius, Lee, GyeongCheol, Sim, KiDong

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1265-1270 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  10. 10
    مؤتمر
    Development of two different molding methods in 2.5D package with 20 μm or less fine bump pitch CoW structure

    المؤلفون: Saito, Takeshi, Ueno, Keiko, Kang, Dongchul, Iseki, Takahiro, Tsai, Shan Ho, Katoh, Sadaaki

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1905-1910 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء