المؤلفون: Arimura, H., Brus, S., Franco, J., Oniki, Y., Vandooren, A., Conard, T., Chan, B.-T., Kannan, B., Samiee, M., Li, W., Deminskyi, P., Shero, E., Bakke, J., Jourdan, N., Verni, G. Alessio, Maes, J. W., Givens, M., Ragnarsson, L.-A., Mitard, J., Litta, E. Dentoni, Horiguchi, N.

المصدر: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023

Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

المؤلفون: Van Damme, J., Ivanov, Ts., Favia, P., Conard, T., Verjauw, J., Acharya, R., Lozano, D. Perez, Raes, B., Van de Vondel, J., Vadiraj, A. M., Mongillo, M., Wan, D., De Boeck, J., Potočnik, A., De Greve, K.

مصطلحات موضوعية: Quantum Physics, Physics - Applied Physics

URL الوصول: http://arxiv.org/abs/2302.03518

المؤلفون: Breuil, L., Nyns, L., Banerjee, K., Palayam, S. Vadakupudhu, Subirats, A., Richard, O., Conard, T., Van den Bosch, G., Furnemont, A.

المصدر: 2019 IEEE 11th International Memory Workshop (IMW) Memory Workshop (IMW), 2019 IEEE 11th International. :1-4 May, 2019

Relation: 2019 IEEE 11th International Memory Workshop (IMW)

المؤلفون: O'Sullivan, B.J., Ritzenthaler, R., Rzepa, G., Wu, Z., Litta, E. Dentoni, Richard, O., Conard, T., Machkaoutsan, V., Fazan, P., Kim, C., Franco, J., Kaczer, B., Grasser, T., Spessot, A., Linten, D, Horiguchi, N.

المصدر: 2019 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2019 IEEE International. :1-8 Mar, 2019

Relation: 2019 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Arimura, H., Cott, D., Boccardi, G., Loo, R., Wostyn, K., Witters, L., Conard, T., Suhard, S., van Dorp, D., Dekkers, H., Ragnarsson, L., Mitard, J., De Heyn, V., Mocuta, D., Collaert, N., Horiguchi, N.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 66(12):5387-5392 Dec, 2019

المؤلفون: Le, Q.T., Gül Arslan, E., Rip, J., De Coster, H., Verdonck, P., Radisic, D., Schleicher, F., Vaesen, I., Conard, T., Altamirano-Sanchez, E.

المصدر: In Micro and Nano Engineering June 2023 19

المؤلفون: Arimura, H., Wostyn, K., Ragnarsson, L.-A., Capogreco, E., Chasin, A., Conard, T., Brus, S., Favia, P., Franco, J., Mitard, J., Demuynck, S., Horiguchi, N.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :29.2.1-29.2.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Arimura, H., Cott, D., Boccardi, G., Loo, R., Wostyn, K., Brus, S., Capogreco, E., Opdebeeck, A., Witters, L., Conard, T., Suhard, S., Van Dorp, D., Kenis, K., Ragnarsson, L.-A., Mitard, J., Holsteyns, F., De Heyn, V., Mocuta, D., Collaert, N., Horiguchi, N.

المصدر: 2019 Symposium on VLSI Technology VLSI Technology, 2019 Symposium on. :T92-T93 Jun, 2019

Relation: 2019 Symposium on VLSI Technology

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المؤلفون: Liu, Enlong, Swerts, J., Devolder, T., Couet, S., Mertens, S., Lin, T., Spampinato, V., Franquet, A., Conard, T., Van Elshocht, S., Furnemont, A., De Boeck, J., Kar, G.

المصدر: Journal of Applied Physics 121, 043905 (2017)

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/1701.07713