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1رسالة جامعية
المؤلفون: Su, Hang
المساهمون: University/Department: Universitat Politècnica de Catalunya. Departament d'Enginyeria Civil i Ambiental
مرشدي الرسالة: Casas Rius, Joan Ramon, Su, Qingtian
المصدر: TDX (Tesis Doctorals en Xarxa)
مصطلحات موضوعية: Steel-concrete composite structure, Partial shear connection, Double composite, Hogging moment regions, Rubber Sleeved Stud Connector, Estructura mixta acero-hormigón, Conexión parcial, Doble acción mixta, Zona de flexión negativa, Conector enfundado en neopreno, Àrees temàtiques de la UPC::Enginyeria civil
وصف الملف: application/pdf
URL الوصول: http://hdl.handle.net/10803/690090
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2دورية أكاديمية
المؤلفون: Psaila, N., Chaboyer, Z., Macdonald, J., Tadayon, P.
المصدر: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 42(15):5223-5230 Aug, 2024
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3دورية أكاديمية
المؤلفون: Luo, J., Gao, J., Zhuang, W., Wang, Z.
المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 72(8):4457-4474 Aug, 2024
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4دورية أكاديمية
المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 34(5):1-5 Aug, 2024
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5مؤتمر
المؤلفون: Xie, Dongji, Hai, Joe, Zou, Vivienne, Wu, Zhongming, Jian, Minghong
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1468-1472 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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6مؤتمر
المؤلفون: Irwin, Randall, Fang, Joanna, Iyer, Subramanian S.
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1797-1803 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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7مؤتمر
المصدر: 2024 12th International Conference on Smart Grid (icSmartGrid) Smart Grid (icSmartGrid), 2024 12th International Conference on. :459-463 May, 2024
Relation: 2024 12th International Conference on Smart Grid (icSmartGrid)
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8مؤتمر
المؤلفون: Bai, Guangze, Gu, Jun, Xing, Yan, Xue, Guiyan, Guo, Xu, Song, Wanze, Luo, Congbo, Gu, Yu, Wei, Lai, Liu, Xue
المصدر: 2024 IEEE 4th International Conference on Electronic Technology, Communication and Information (ICETCI) Electronic Technology, Communication and Information (ICETCI), 2024 IEEE 4th International Conference on. :1495-1501 May, 2024
Relation: 2024 IEEE 4th International Conference on Electronic Technology, Communication and Information (ICETCI)
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9مؤتمر
المؤلفون: Kitazawa, Taiki, Fujimoto, Daisuke, Hayashi, Yuichi
المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :2-5 May, 2024
Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)
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10مؤتمر
المؤلفون: Liu, Shitao, Bi, Yu, Yi, Bi
المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :190-193 May, 2024
Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)