يعرض 1 - 10 نتائج من 943 نتيجة بحث عن '"Copper nanoparticle"', وقت الاستعلام: 0.90s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Model-Based Derivation of Electrical Parameters and Impedance Study of Two-Electrode Copper Nanoparticle-Based Pencil-Drawn Glucose Sensor

    المؤلفون: Singh, A., Bhuyan, M., Hazarika, A., Dutta, L.

    المصدر: IEEE Transactions on Industrial Informatics IEEE Trans. Ind. Inf. Industrial Informatics, IEEE Transactions on. 20(2):2897-2906 Feb, 2024

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  2. 2
    مؤتمر
    Low Temperature Sapphire to Silicon Flip Chip Interconnects by Copper Nanoparticle Sintering

    المؤلفون: Ji, Xinrui, Van Zeijl, Henk, Romijn, Joost, Van Ginkel, Hendrik Joost, Liu, Xu, Zhang, Guoqi

    المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :368-372 Sep, 2022

    Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

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  3. 3
    دورية أكاديمية
    Temporal overlapping effect of the pump–probe technique on rhodamine 6G with the addition of copper nanoparticles

    المؤلفون: Rahi, Saad Kh.Aff1, IDs12596023015467_cor1

    المصدر: Journal of Optics. :1-9

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  4. 4
    دورية أكاديمية
    Colorimetric Recognition of 3,4-Dihydroxy-D,L-phenylalanine with Tetrapeptide-modified Copper Nanoparticles as Chiral Nanozymes

    المؤلفون: Tian, LinAff1, Aff2, Cheng, ChengAff1, Aff3, Zhao, ZhenwenAff1, Aff4, Liu, WeiAff2, IDs402420233193z_cor4, Qi, LiAff1, Aff4, IDs402420233193z_cor5

    المصدر: Chemical Research in Chinese Universities. 39(6):1092-1099

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  5. 5
    دورية أكاديمية
    Synthesis, characterization and performance of nanocopper impregnated sawdust-reinforced nanocomposite

    المؤلفون: Haque, Md. Eyazul, Khan, Md. WahabAff1, Aff2, Aff4, IDs00289022044965_cor2, Hasan, Mohammad Mahamodul, Chowdhury, Md. Najmul KabirAff2, Aff3, IDs00289022044965_cor4

    المصدر: Polymer Bulletin. 80(11):12393-12416

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  6. 6
    دورية أكاديمية
    Phytochemical Analysis of Silver Nanoparticles of Zingiber officinale and Evaluation for Its Antibacterial Property

    المؤلفون: Krishna Goutham, Brahma Neha, Alex Arockia

    المصدر: Journal of Pharmacy and Bioallied Sciences, Vol 16, Iss 6, Pp 1226-1232 (2024)

    مصطلحات موضوعية: antibacterial, antioxidant, copper nanoparticle, zingiber officinale, Pharmacy and materia medica, RS1-441, Analytical chemistry, QD71-142

    وصف الملف: electronic resource

    Relation: https://journals.lww.com/10.4103/jpbs.jpbs_547_23; https://doaj.org/toc/0976-4879; https://doaj.org/toc/0975-7406

    URL الوصول: https://doaj.org/article/2fe1bf1e007b4c02ba433ca957cefdaa

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  7. 7
    مؤتمر
    Enhancement of Copper Nanoparticle Paste by Pressure-less Sintering on Different Substrates in Pt-catalyzed Formic Acid Atmosphere

    المؤلفون: Li, Junlong, Xu, Yang, Shang, Panju, Wang, Yinghui, Suga, Tadatomo

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Study on thermal stability of all copper interconnect structures under thermal shock

    المؤلفون: Li, Hao, Shen, Jun, Xie, Jiacheng

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Rapid Enhancement of Thermal Conductivity by Incorporating Oxide-Free Copper Nanoparticle Clusters for Highly Conductive Liquid Metal-based Thermal Interface Materials

    المؤلفون: Ki, Seokkan, Shim, Jaehwan, Oh, Seungtae, Ryu, Seunggeol, Kim, Jaechoon, Nam, Youngsuk

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :601-606 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Highly strength Cu-Cu joint formation by sintering of copper nanomaterials

    المؤلفون: Lai, Tao, Zhang, Yu, Yang, Guannan, Cui, Chengqiang, Cao, Ping, Leng, Jiewu

    المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

    Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

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