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1مؤتمر
المؤلفون: Wu, Chunlei, Corinne, Berges
المصدر: 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the. :267-270 Jun, 2015
Relation: 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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2دورية أكاديمية
المؤلفون: Wu, Chunlei, Yao, Suying, Corinne, Bergès
المصدر: In Microelectronics Reliability February-March 2015 55(3-4):463-469
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المؤلفون: Corinne Berges, Jim Bird, Mehul D. Shroff, Edwin Lumanauw, Sreerag Raghunathan, Chris Smith
المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d9afc90995e53730cd63f588119063aa
https://doi.org/10.1109/ipfa55383.2022.9915769 -
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المؤلفون: Jim Bird, Rene Rongen, Corinne Berges, Chris Smith, Mehul D. Shroff
المصدر: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
مصطلحات موضوعية: Semiconductor industry, Computer science, business.industry, Yield (finance), media_common.quotation_subject, Data analysis, Automotive industry, Quality (business), Root cause, business, Manufacturing engineering, media_common
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4ad86ae35287d9e02382d90b7a7614eb
https://doi.org/10.1109/ipfa53173.2021.9617238 -
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المؤلفون: Jim Bird, Shahrul Mazli Mustafa, Claire Ceneray, Bala Balakrishnan, Chris Smith, Corinne Berges, Bryan Rubink, Sascha Moeller, Guido Albermann
المصدر: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
مصطلحات موضوعية: Data collection, Traceability, business.industry, Computer science, Process (engineering), Big data, Automotive industry, Context (language use), Machine learning, computer.software_genre, Analytics, Key (cryptography), Artificial intelligence, business, Algorithm, computer
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a9728139316967bddf28cb0497fdf931
https://doi.org/10.1109/ipfa49335.2020.9260582 -
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المؤلفون: Corinne Berges
المصدر: ICTACT Journal on Microelectronics, Vol 4, Iss 1, Pp 537-541 (2018)
مصطلحات موضوعية: htol, industry, automotive semiconductor, lcsh:Electronics, lcsh:TK7800-8360, manufacturing test, failure rate prediction
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doajarticles::9e75e4d452ce51c3e4d5f4e0a5e591ca
http://ictactjournals.in/paper/IJME_Vol_4_Iss_1_Paper_6_537_541.pdf -
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المؤلفون: Gaojie Wen, Haus Zhang, Xuejian Qian, Chi He, Jun Ren, Li Tian, Corinne Berges, Jinrong Song
المصدر: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).
مصطلحات موضوعية: 010302 applied physics, business.industry, Computer science, Design of experiments, 020208 electrical & electronic engineering, Delamination, Process (computing), Automotive industry, Statistical model, 02 engineering and technology, 01 natural sciences, Reliability engineering, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Sensitivity (control systems), Product (category theory), business, Reliability (statistics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6433bf011a115fd9f0ec80b38b36454b
https://doi.org/10.1109/ipfa47161.2019.8984789 -
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المؤلفون: Corinne Berges, Yann Weber, Pierre Soufflet
المصدر: Microelectronics Reliability. 55:1346-1350
مصطلحات موضوعية: Engineering, Acceleration factor, business.industry, Semiconductor device fabrication, Automotive industry, Power reliability, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Reliability engineering, Robustness (computer science), Statistical analysis, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Short circuit
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المؤلفون: Sting Chung, Corinne Berges
المصدر: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
مصطلحات موضوعية: Engineering, 021103 operations research, business.industry, Semiconductor device fabrication, 0211 other engineering and technologies, Automotive industry, Failure rate, 02 engineering and technology, Field (computer science), 020202 computer hardware & architecture, Reliability engineering, Data modeling, Sample size determination, 0202 electrical engineering, electronic engineering, information engineering, business, Reliability (statistics), Statistical hypothesis testing
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::87b90999a48be0de39b938638aea05dc
https://doi.org/10.1109/ipfa.2017.8060098 -
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المؤلفون: Abdeslam Jadrani, Pierre Soufflet, Corinne Berges
المصدر: Microelectronics Reliability. 54:1887-1890
مصطلحات موضوعية: Engineering, Process (engineering), business.industry, media_common.quotation_subject, Automotive industry, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Die (integrated circuit), Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Reliability engineering, Reliability (semiconductor), Component (UML), Quality (business), Electrical and Electronic Engineering, Power MOSFET, Safety, Risk, Reliability and Quality, business, Risk assessment, media_common